Electronics Forum: yield (Page 36 of 55)

Selective Soldering Issues

Electronics Forum | Fri Jun 22 21:07:08 EDT 2012 | tank1266

I have had Selective issues such as yours on two very different Selective Solder Machines. I was able to eliminate these issues by using Alpha EF-9301 wave flux with any SAC305 solder. It's a more aggressive flux, but really made the difference. Anot

ICT testing to improve yields

Electronics Forum | Tue Aug 21 19:24:15 EDT 2012 | rway

Checksum will work if all your doing is analog/passive testing. Checksum systems do not have digital test capability. I would recommend a Teradyne z18xx system. We use 8 of them in our plant and have been for years. Used, these systems range from

ICT testing to improve yields

Electronics Forum | Mon Aug 27 08:22:39 EDT 2012 | rway

Dan_ems wrote, "I already build such a system with hardware and software from National Instruments. I think is the best solution because you can buy for the start only a Multimeter (DMM), a multiplexer and a software. Is very easy to do the programmi

ICT testing to improve yields

Electronics Forum | Mon Aug 27 09:23:22 EDT 2012 | rway

Which military? The US? Being a military contractor, I am surprised at your lack of quality at your facility. I suspect this is non-US military. I don't know where you are located, but being a contract mfg for the military, any military, I can im

Trouble selective soldering fine pitch connectors

Electronics Forum | Mon Dec 10 13:26:40 EST 2012 | dyoungquist

We are using our selective solder machine to solder a backplane with sixteen (16) 4x48 pin 0.080" connectors. Our first pass yield is about 85% meaning that 85% of the connectors come out with no bridges. Not quite as fine pitch as your connector a

Quad IVc Pickup Optimization Help

Electronics Forum | Wed May 01 15:27:22 EDT 2013 | lheiss

Hi All, I've been using a IVc for many years. I'm to the point where I have Mod Code 8 = 15, MC9 = 500, and all Extents PU delays set to 40ish. These settings work pretty well but I would like to get them closer to factory defaults to save the los

Through Hole Pad contamination

Electronics Forum | Mon Nov 11 08:47:00 EST 2013 | mleber

Thanks guys. Here are more details. The cards are essentially the same. They use the same connectors, same footprint, the traces / layers would be comparable etc. The difference between the 2 we see is that one is laminate - Rigid Metal Clad Base, Ty

High Relative Humidity and Blistering Issues in Assembly

Electronics Forum | Mon Sep 08 21:12:29 EDT 2014 | eurekadrytech

Hello, Manufacturing process with high moisture and humidity environments and long term storage will definitely see pop corning effects once high temperature from soldering and/or re-flow process. The moisture that has been adsorbed is likely the ro

63/37 HASL Finish / RoHS Solder Paste

Electronics Forum | Sun Dec 11 22:55:22 EST 2016 | ppcbs

What type of flux is in your solder paste? Active or No-Clean? With lead free solder you really should be using an active flux. The lead free oxidizes during reflow if you are not using a Nitrogen or Vapor Phase reflow. So a more robust and activ

Help understanding something about stencil orientation when printing

Electronics Forum | Tue Nov 08 12:05:57 EST 2016 | aemery

Lachrymal, Where are you getting that from. Let me keep this simple because there can be so many variables in modern printing, some you can control and some you can't. Unless you are designing your own PCB's where you can decide how to orient the co

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