Electronics Forum: yield (Page 41 of 55)

Re: BGA and Gold Boards

Electronics Forum | Wed Jun 24 16:23:29 EDT 1998 | Justin Medernach

Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. Mike Mike, Your concer

Re: Solutions For Low Volume BGA/SMT Rework

Electronics Forum | Thu Feb 19 13:52:58 EST 1998 | mike c

We are in need of a low cost system for the rework of various SMT devices. Ideally the machine should support BGA, SQFP, and large PLCCs. Is it a dream to ask for SMT tweezers, a regular iron, and a convection pencil as well? Want a machin

DPMO calc and Overall Manufacturing Index (OMI) calculations

Electronics Forum | Tue Aug 28 12:25:26 EDT 2001 | Steve

To be honest with you, it doesn't really matter how you present the data, as long as you understand what the problems are. Bottom line is who cares what the numbers are unless you are doing something about it. Are you able to track the individual de

DPMO calc and Overall Manufacturing Index (OMI) calculations

Electronics Forum | Tue Aug 28 13:46:46 EDT 2001 | mparker

To clarify on "Opportunities"- With 1000 components, the opportunities are far greater than 1000. You have 1 opportunity per component for a component defect i.e. bent lead, damaged part, tested bad, etc. You have a second opportunity per component

DPMO calc and Overall Manufacturing Index (OMI) calculations

Electronics Forum | Thu Sep 13 13:29:06 EDT 2001 | mparker

Dave et al, I just print out and read a copy of the aforementioned recommended article. Mr. Mangin gives a clear picture of why DPMO is to be considered a more pure data than First Pass Yield (FPY). However, I must note that his interpretation of h

Paste Inspection Requirements

Electronics Forum | Wed Sep 19 15:32:24 EDT 2001 | jschake

I�ll volunteer to answer this one for Jake. In order to prove the performance and capability of the stencil printing process, I think this level of inspection detail is required. However, in a production scenario where a known printing performance

Spacing and Yield

Electronics Forum | Tue Sep 18 11:34:36 EDT 2001 | jschake

The tightest spacing between neighboring 0201 components assembled was 8-mils. Please refer to the response for the query entitled �Minimizing Tombstoning Defects� posted by martys, as the response provided there is also relevant to address this que

Print Parameters

Electronics Forum | Tue Sep 18 12:05:08 EDT 2001 | jschake

Optimal Print Parameters: I have responded to a similar question in the thread titled �Stencil Printing For 0201 Applications�, posted by markt and will refer you to that for addressing this question. If you seek clarification on any of those point

0201 solder beading

Electronics Forum | Fri Sep 21 14:03:45 EDT 2001 | jschake

I have observed solder balling for all aperture sizes tested. Solder balling levels appear to be better correlated against the amount of solder paste that is underneath the 0201 component terminations after placement rather than comparing this to th

White residues

Electronics Forum | Mon Apr 22 20:55:00 EDT 2002 | ianchan

Hi, this is not really a technical solution, just a feedback. we too have a model series using the same WS paste type. it gives a dull solder joint with white residue that can be marginally removed after post-DI water rinse (ie. not 100% removed).


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