Electronics Forum | Tue Jan 12 19:49:28 EST 1999 | Ross Berntson
| Hi Folks. Has any Process Engineer here done a complete evaluation or controlled experiment for VOC-FREE Flux? Our goal here at CEBUKid, Inc. is to implement a VOC-FREE process. We have all the necessary (OPTIFLUX) spray equipment, and we're cur
Electronics Forum | Wed Sep 02 08:44:50 EDT 1998 | Kelly Morris
| Hi, | We are having problem with yield loss due to electrical fail. Further investigation shows that the failure is due to solder bridging under BGA. Has been there any study or experience on how this could occur and what we can do to prevent it.
Electronics Forum | Thu Aug 27 12:28:02 EDT 1998 | Ryan Jennens
| | What approach do you you use to reducing wave solder dross? What is your experience with Klennox? | | Dave F | Klennox should be spelled Kleenox. Dave F Kleenox works well for removing accumulated dross as it separates the dross from the solde
Electronics Forum | Tue Jul 14 16:53:43 EDT 1998 | B. Decker
| | | Dear Colleagues: | | I am looking for quantiative data on comparing the effects of depaneling/routing versus other forms of singulation specifically shearing, | | I need data not opinions. | | Thanks in advance for your help. | | Sincerely
Electronics Forum | Thu Apr 16 14:09:04 EDT 1998 | Lou Madge
Dear Collegue, A seminar tittled "Things that you should know before selecting an alternative surface finish" will be offered on Friday, April 24 (during the week of the Nepcon East show) in Philadelphia. Topic that will be discussed include: Evalua
Electronics Forum | Thu Apr 16 14:07:49 EDT 1998 | Lou Madge
Dear Collegue, A seminar tittled "Things that you should know before selecting an alternative surface finish" will be offered on Friday, April 24 (during the week of the Nepcon East show) in Philadelphia. Topic that will be discussed include: Evalua
Electronics Forum | Sun Feb 15 18:07:18 EST 1998 | Scott McKee
| I am beginer in BGA assembly and am confused in selection of pick and place option. As per book on 'implementation of BGA Technology-by 1995 aeic inc. states that BGAs reflow is quite forgiving and you need only Mechanical centering of PBGAs. The I
Electronics Forum | Sat Feb 14 13:33:10 EST 1998 | ashok dhawan
| I am beginner in BGA assembly and am confused in selection of centering method on pick and place operation.. As per book on 'implementation of BGA Technology-by 1995 aeic inc. states that BGAs reflow is quite forgiving and you can use Mechanical c
Electronics Forum | Wed Sep 05 08:22:48 EDT 2001 | davef
Jack Crawford, IPC Director of Assembly Standards and Technology says "IPC-7912 is used for end-item DPMO calculation; one gathering of DPMO data at the end of the entire assembly process. IPC-9261 will be used throughout the manufacturing process so
Electronics Forum | Mon Sep 17 16:03:13 EDT 2001 | jschake
The results from an experiment comparing 27 different combinations of pad dimensions concluded that the pad design with 15 mil pad length, 12 mil pad width, and 9 mil pad separation produced the best assembly yields. A 5 mil thick laser cut stencil