Electronics Forum | Tue May 17 10:11:54 EDT 2005 | russ
I would use a foam fluxer since spraying rosin will make the stickiest nastiest mess you can imagine. 18 layer board huh? You will want convection preheat, both top and bottom preheaters, preheat tunnel of at least 4-5', a chip wave, laminar flow w
Electronics Forum | Tue Aug 31 08:10:38 EDT 1999 | Brian Conner
| I am building a board with T1/34 LED's in a 10X10 array there are 12 arrays in a panel. The LED's are body to body in the array, .1 spaced. The LEDS have been autoinserted on a Universal RAD III, so they are cut and clinched. The trouble I am havin
Electronics Forum | Mon Dec 23 17:20:05 EST 2002 | davef
Try: * Prebake * Flux density * Conveyor speed * Upper preheat * Cooling time * Chip wave * Solder temperature You could add immersion depth (1/3 to 2/3 of the board) to convince yourself that it has the least impact of any variable in wave solderin
Electronics Forum | Fri Oct 23 14:58:40 EDT 1998 | Dave F
| We've got a continous flow cooling problem from our wave solder process into ICT. Our current configuration is a flatbelt conveyor into a manual de-pallet process, operator then places on to an edge conveyor. We've tried muffin fans, look good bu
Electronics Forum | Fri Oct 23 09:44:43 EDT 1998 | Chrys
| We've got a continous flow cooling problem from our wave solder process into ICT. Our current configuration is a flatbelt conveyor into a manual de-pallet process, operator then places on to an edge conveyor. We've tried muffin fans, look good bu
Electronics Forum | Fri Oct 23 09:29:29 EDT 1998 | Allen
We've got a continous flow cooling problem from our wave solder process into ICT. Our current configuration is a flatbelt conveyor into a manual de-pallet process, operator then places on to an edge conveyor. We've tried muffin fans, look good but
Electronics Forum | Fri Jun 07 04:57:53 EDT 2019 | gregoryyork
Its more than likely the conveyor is slightly out and needs dropping. You do have a fairly significant contact though so are you sure the Solder pot isnt running too cool for Lead free, needs to be around 275C for good wicking and flow or 250C if lea
Electronics Forum | Mon Oct 21 18:31:45 EDT 2002 | MikeF
Mike, If your wave solder machine doesn't have enough preheat capacity you can put the board in an oven and warm it part way before you put it into the wave solder machine. This works best with a spray fluxer, as a warm board will collapse the foam
Electronics Forum | Fri Oct 23 15:44:57 EDT 1998 | Mike
| We've got a continous flow cooling problem from our wave solder process into ICT. Our current configuration is a flatbelt conveyor into a manual de-pallet process, operator then places on to an edge conveyor. We've tried muffin fans, look good bu
Electronics Forum | Thu Oct 14 23:01:48 EDT 1999 | Dennis O'Donnell
With loaded boards, warpage can be removed by placing the assembly in a wave solder conveyor pallet as you would if you were going to wave solder the assembly. Place board and fixture in a Blue M forced air oven at 90 C for 30 minutes. Let cool to r
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