Electronics Forum | Thu Aug 19 11:19:41 EDT 1999 | Rich Cary
| Is anyone aware of a good, basic Electronics assembly course? There is a manufacturing project leader in my company that needs to get some good exposure ... quickly. He is particularly interested in design for manufacturing. | Mike, I just inve
Electronics Forum | Tue Aug 17 22:51:32 EDT 1999 | KEVIN SIMPSON
| | Does any one have any idea which is usualy more expensive, to get components on Reels or in Trays ( I mean large components ofcourse). | | What is price diffrence percentage ? | | | | practicaly, is one method is prefered to the other? | | | |
Electronics Forum | Tue Aug 17 14:08:50 EDT 1999 | Glenn Robertson
| We have a design on which there is an ASIC that will not be produced anymore in the future. As we want to make this design over the next 10 years we are evaluating the possibility to buy the necessary ASICs for the next 10 years. This will give us
Electronics Forum | Tue Aug 17 10:41:13 EDT 1999 | Steve A
Wayne, Sounds like a gasketing problem. When the horizontal apertures are bleeding but not the vertical apertures. Could be poor underside support, HASL miniscus issues, masking or plugging issues, but what many people do not account for is that t
Electronics Forum | Thu Aug 19 19:10:31 EDT 1999 | Brian Wycoff
| | | | Hello, | | | | | | | | Can any netters suggest what critical parameters should be considered & what are there assoicated impacts for a solder paste printing process ... | | | | | | | | B.Regards, | | | | Felix | | | | | | | I have a proce
Electronics Forum | Thu Aug 12 17:26:31 EDT 1999 | Brian Wycoff
| | | | Hello, | | | | I am currently looking for a solder paste height inspection system (preferably one that will go in-line). | | | | Can anyone reccommend any? | | | | Thanks | | Steve | | | Steve, | Cybersentry makes an easy to pr
Electronics Forum | Thu Aug 05 08:39:26 EDT 1999 | Wayne Sanita
| | | Hello, If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same problem with chip components but after c
Electronics Forum | Mon Aug 02 18:46:33 EDT 1999 | Jim Blankenhorn
| | Has anyone done the research on BGA pad size? suppose I have a 0.030" diameter pad as recommended pad size from the spec, what will the minimum pad size allowed? We are laying out a high density board. | | If you know what component your'e going
Electronics Forum | Fri Jul 30 19:19:21 EDT 1999 | M Cox
| So is anyone going to attend Nepcon Texas in Dallas, or is it a waste of time? | | So far I don't see some of the big players, and I would assume they would have their trade show dollars mapped way in advance. | | Being in San Antonio (should I
Electronics Forum | Tue Jul 27 16:30:35 EDT 1999 | Earl Moon
| Can anyone give me the virtues of SMT package castellations vs. no castellations with particular reference to the ruggedness and reliability of the solder joints? Any references or studies that you can point me to? Also, although I'm in favor of
