Electronics Forum: you (Page 1631 of 3791)

Re: Reflow Profiling

Electronics Forum | Fri Nov 27 13:04:47 EST 1998 | Phillip Hunter

| Hi | I have been conducting my first reflow profiles. Most of the texts that I have read suggest soldering the thermocouples to a populated pcb. I am finding this very difficult. I have been using a high melting point (Sn5 / Pb95) solder and the

Re: Big SMEMA Troubles :-(

Electronics Forum | Tue Nov 03 22:11:38 EST 1998 | phillip hunter

| SMTnetters: | | My UIC conveyors aren't working with my: | | �Omniflow 7 Reflow (Mfg 1/95) | �Dek 265 GS | �Philips CSM | | | What can I do? Does anyone have experience with connecting UIC or other conveyors to the above equipment? On the refl

Re: Cleaning No-Clean

Electronics Forum | Fri Oct 16 13:11:49 EDT 1998 | Steve A

The Kyzen product was brought to my attention from a chemist at Kester solders when I asked him what could remove no clean residue from a PCB that had been built weeks earlier. We soaked it in the Kyzen for 8 minutes and ran the board through the aq

Re: Cosmetics For PCBs

Electronics Forum | Fri Oct 02 16:49:33 EDT 1998 | Dave F

Benji: I tend to agree with you that assemblers shouldn't wear make-up. I'm unsure what first level assemblers are tho. I've been down that finger cot/glove route ... 1 If someone is going to smear facial or cosmetic oil on a board, they can do

Re: unsoldered joints

Electronics Forum | Tue Sep 22 12:25:31 EDT 1998 | Chrys

| | Hi Jacqueline! | | Do these joints that you're having problems with happen to be on fine pitch solder joints? Are the fillets staying attached to the foot and separating from the pads cleanly? | | If that is true, are there many vias concen

Re: Wave Solder Fixtures: Biting the dust FAST!

Electronics Forum | Tue Sep 15 07:54:42 EDT 1998 | Rob Fischer

| | I am running composite fixtures on my wave solder machine and after about 500 passes each (1 month)they are showing serious signs of wear in that the composite surface is bubbling up and glass fibers are also starting to show. | | The problem h

Re: 8 mil placement, part Deaux!!

Electronics Forum | Fri Sep 11 14:39:02 EDT 1998 | Earl Moon

| Thanks to all Earl, Mathew and David for the SMT info. I have one more question. Does anybody have a chart listing the standard, industrial spacings? Perhaps listing in each unit, say XX mils = XX Pitch. Or XX mils = XXmm or something of that n

Re: placement of 8 ml smt components

Electronics Forum | Thu Sep 10 17:10:00 EDT 1998 | Steve Gregory

Hi Tim, 8-mil huh? Boy, that's getting down there...you know, placing 8-mil is one thing, but printing solder paste on 8-mil pitch is another. Most of the time when I've seen 8-mil pitch on a board it's been attached with hot-bar...but I guess

Re: Conductive adhesive

Electronics Forum | Mon Aug 24 08:44:52 EDT 1998 | Justin Medernach

| | | Require a conductive adhesive - either isotropic or anisotrpic - which can be used for 100micron oitch devices. | | | Must be resistant to solvents such as MEK and acetone. | | | Cure below 150C, with possible potential for rework of the conec

Re: Microcracking in SMT Pick&Place process

Electronics Forum | Thu Jun 25 09:37:48 EDT 1998 | Russ Miculich

The real causes of microcracking are not normally due to pick and place - particularly if you are using a piece of equipment with vacuum pick up and release. The real cause of microcracking is due to thermal stresses on the die and the choice of the


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