Electronics Forum: you (Page 1921 of 3790)

Re: Soldering to Paladium vs. Tin_Lead plated comps

Electronics Forum | Fri Feb 20 09:41:11 EST 1998 | Chrys Shea

| I have been involved in SMT for only a few months so I am coming from a position of extreame ignorance. I have been asked to investigate the differences in soldering to components with Paladium coated leads vs the standard Tin_lead. I would appre

Any success using metal squeegees w/Fuji GSPII?

Electronics Forum | Thu Jan 29 16:35:37 EST 1998 | David Spilker

Using metal squeegees on GSPs has caused premature stencil wear. Has anyone had any success with this combination? How much snap off did you use? We are using .5 mm pitch and have a no clean process.

Re: Any success using metal squeegees w/Fuji GSPII?

Electronics Forum | Fri Feb 20 14:16:06 EST 1998 | Dave McFadyen

I've been using metal blades on several brands of printers over the past few years and have to agree with comments in other replies. Contact print is a must or you will tear slits in your stencils at the ends of the blade. Center-mounted (floating) s

OSP's

Electronics Forum | Thu Jan 29 14:03:57 EST 1998 | Chrys Shea

Entek or Protecto? I've hear Kester's Protecto is a very good OSP that may be more assembly process-friendly than Entek. Is anyone using this? Do you have any feedback on its solderability or availablity compared to Entek? Any non-commerical input w

Tin Immersion (Dexcoat FST) instead of HASL for SMT assembly.

Electronics Forum | Mon Jan 19 10:13:37 EST 1998 | John Haman Jr.

We are currently investigating alternatives to HASL for circuit boards with 20 mil pitch smt pads and below. If you have experience with this product or simular immersion tin products with respect to manufacturing or assembly I am very interested i

Tin Immersion (Dexcoat FST) instead of HASL for SMT assembly.

Electronics Forum | Mon Jan 19 10:13:01 EST 1998 | John Haman Jr.

We are currently investigating alternatives to HASL for circuit boards with 20 mil pitch smt pads and below. If you have experience with this product or simular immersion tin products with respect to manufacturing or assembly I am very interested i

Why reflow technology ?

Electronics Forum | Sat Jan 03 06:17:39 EST 1998 | cacciatore francesco

I'm looking for informations about the reflow technology. Wat cost reduction can expect to reach? Wat size reduction can expect to reach? How to make the choice between wave and reflow technology? Market trends ? All about how to implement the reflow

Tomb stoning

Electronics Forum | Mon Dec 22 02:25:45 EST 1997 | Sultan Mahmood

WE have a problem of tomb stoning in our smd assemblies during curing process of the boards in our Infra Red Soldering bath. Would you like to give us solution how to resove this proble? Thankyou Regards

Re: Tomb stoning

Electronics Forum | Mon Dec 22 02:33:25 EST 1997 | jergog

do a good edit on the smt machines | WE have a problem of tomb stoning in our smd assemblies during curing process of the boards in our Infra Red Soldering bath. Would you like to give us solution how to resove this proble? | Thankyou | Regards

Re: BGA Rework

Electronics Forum | Fri Mar 27 19:53:06 EST 1998 | Tony Arteaga

If you still interested in information on BGA rework, please e-mail me. We currently provide BGA rework, from re-balling and placement of bga. Thanks Tony A


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