Electronics Forum: you (Page 2566 of 3791)

Re: Siemens 80s20 throughput !!

Electronics Forum | Fri Jan 21 05:39:58 EST 2000 | Scott Davies

Hi ZJJ, I know exactly where you're coming from on this one! We have a similar situation here with a SiPlace 80S-15, rated at 15K max per hour. In practice, we achieve about 11K. The reason is fairly straightforward. The quoted maximum placements pe

Re: Mid Chip Solder Balls

Electronics Forum | Fri Jan 14 16:58:20 EST 2000 | Dave F

Dave: You're probably correct about too much paste, given that your balling is congrigated near the center of the chips. Three things to consider: 1 Lower temperature profile @ front 3 zones 2 I've heard some stencil suppliers can plate addition

Re: Mid Chip Solder Balls

Electronics Forum | Fri Jan 14 17:24:08 EST 2000 | John Thorup

Yeah, it would be kind of expensive to replace all of your stencils but it's the only real answer. Be sure that all your new and replacement stencils have a home base or home plate shape for the passives. This reduces the paste volume near the cent

Re: gold fingers over wave

Electronics Forum | Thu Jan 13 13:16:40 EST 2000 | Dave F

Tony: You have choices: * Hi Temperature Tape: Go with Wolfgang ... too tough to control. * Selective Soldering Pallets: Some like 'em some don't. A lot of your success depends on the pallet fabricator. * Screenable Temporary Solder Mask: Wol

BGA Bouble sided reflow overlapping

Electronics Forum | Wed Jan 05 11:01:37 EST 2000 | Ron Lahat

I have in design a 400mm x 400mm pcb 3.0 mm thick heavily populated with BGAs 50 mil pitch and want to run a double sided reflow process with overlapping BGAs (CS/PS) 1. can I avoid a selective jig for PS BGAs?(weight calculation ?) 2. Is it possibl

Re: x-ray systems

Electronics Forum | Wed Jan 05 11:43:11 EST 2000 | Dave F

Yins, In low volume applications, using X-ray for BGA mounting process control is: 1 Very expensive approach, as you've stated. 2 Requires beaucoup operator training and interpretation of results. Which is double bad, because of the intermittent n

Re: Immersion White Tin Process for PCB Finish

Electronics Forum | Fri Jan 14 08:05:23 EST 2000 | Pat Pepper

Hi Dave, Thank you for the response. In answer to your responses I'll use the original numbers of my questions. 1. We would like to turn around our boards fast, but sometimes due to the market conditions we wind up with inventory. After reading

Re: Wave Soldering 0603

Electronics Forum | Wed Dec 22 05:42:19 EST 1999 | Wolfgang Busko

Hi John, I�ve seen problems some sites have or had with bridging problems in the wavesolder process with 1206 and 0805. Adjusting the system and focussing on the flux parameters sometimes improved things. With some older systems it was hard to get s

selective wave soldering unit

Electronics Forum | Mon Dec 20 08:26:17 EST 1999 | pascal MATHIEU

hello guys ; we are using some standard selective wave soldering unit used in lined ; the drawback of a such machine is 1/the speed which is quiet low (the board is coming on position through the conveyor, then the head delivering the solder moves s

Re: Adding leads to leadless parts

Electronics Forum | Sun Dec 19 08:05:14 EST 1999 | Dave F

Clarissa: We've all done thing on a limited basis, especially on prototype boards, but this doesn't sound like a limited basis, or prototype boards. (And may be I reading too much into this, we all know the frailities of conversing like this.) Thi


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