Electronics Forum | Mon Jul 19 19:22:09 EDT 2004 | g2garyg2
Laser Marking stations generally accept the product, clamp it in place, then through a motion platform move the product underneath the laser head. Marking is generally conducted with a CO2 laser ranging between 20 to 30 watts. You will loose 20% thro
Electronics Forum | Wed Jul 14 17:33:04 EDT 2004 | Ross Clunie
The short answer is "No" the white and green feeders are not interchangble. The green feeder has a channel in it to allow the "embosed" or plastic tape to fit flat at the pickup position. If you use paper tape in this type of feeder the tape can be d
Electronics Forum | Wed Dec 22 20:51:12 EST 2004 | Mark
Yes, shameless. You could have come out and said that APE's equipment is the best thing since sliced bread but . . . you had to get all scientific with us. We already get bombarded by subliminal messages in commercials now, tech forums. In all ser
Electronics Forum | Mon Jul 19 16:26:09 EDT 2004 | davef
Your fab has supplied you with unsolderable boards. They are dewetted, due to some process problem. That they are dewetted on the annular ring of the via indicates that the problem is with the board and not with your paste. [We assume you do not p
Electronics Forum | Mon Jul 26 22:14:22 EDT 2004 | pdeuel
Cognex version drives the vidio. If you are getting an image then cognex is not an issue. Thru bore calibration of the camera is the alignment of the upward looking with respect to the downward looking. One camera dose it all getting the image thru o
Electronics Forum | Thu Jul 22 07:52:37 EDT 2004 | Chris L.
Hi Grant, The purpose for allowing the solder paste to reach room temp before production is to reduce the amount of water absobtion from the air. (e.g. a cold glass of water "sweats" on a humid day)The purpose for mixing is to make the viscosity more
Electronics Forum | Wed Jul 28 18:51:52 EDT 2004 | gregoryyork
Found problem many years ago by chemical extraction and IR analysis, produces alarming amounts of plasticizer from under cured or incorrect mix of hardener to liquid photoimageable solder resist. Problems this causes are endless and many things blame
Electronics Forum | Wed Aug 04 16:09:48 EDT 2004 | Dreamsniper
Hi, Thanks for your reply. I run 2 boards, using the same paste, thermal profile and the same method of aqueous cleaning, 1st is a Topline test board with topline BGA (BGA 272 with 1.27 Pitch) and the 2nd is our product PCB with our BGA from Motoro
Electronics Forum | Wed Aug 04 20:06:24 EDT 2004 | C.W
Customer returned a brd claim that one of the FPGA is having "cold solder joint". I inspected the the BGA location with X-ray and Ersascope, balls' shape look fine, voids are not detected, perimeter joints show shinny and smooth appearance, i have se
Electronics Forum | Mon Aug 16 16:37:08 EDT 2004 | davef
As we mentioned in an earlier response in this thread [Q5], you do NOT want to solder to hard gold. Hard gold is a wear surface. [That's IT, that's the LIST.] If you want to solder to gold, then either use: * IPC-4552 ENIG specification, mentioned
