Electronics Forum | Tue May 30 08:24:23 EDT 2000 | David Lazarus
Could some of you give me ideas where I could find articles or studies about market or player performance in the SMT/through hole industry (specifically, OEM's for the automotive industry)? I am part of design team for a scholastic design project at
Electronics Forum | Tue May 30 14:49:03 EDT 2000 | Kris W
Dreamsniper, The only difference that I am aware of is that you have to change the component definition to match the feeder. The Multi-pitch feeders locate the tape in a different location than the standard feeders. We have been using the multi-pi
Electronics Forum | Sat May 27 14:09:23 EDT 2000 | do ngoc hung
MAY YOU HELP ME TO SOVLE THE PROBLEMS IN MACHINE. I CAN NOT CHECK NOZZLES IN CENTER, BRIGHTNESS MODE OR THE CCD CAMERA CAN NOT CAPTURE THE NOZZLES. SO MAY I HAVE ANY INFO ABOUT IT. PLS GIVE ME A ADVICE ASAP VIA EMAIL. THANKS AND BEST REGARDS. DO
Electronics Forum | Tue May 30 20:56:27 EDT 2000 | Dave F
Chua: No AI on SMT troubleshooting that I'm aware of. Don't dispare though, we're here to help you. Consider checking the SMTnet archives. There is a bountiful amount of information there. Good luck. And we hope over time that the burden of hav
Electronics Forum | Fri May 26 05:49:09 EDT 2000 | Richard Wilders
1.67. A lower accuracy will result in many off-pad flipchips; this means a lot of displacements. And there is no chance at all the flipchip will self-center back to the correct placement spot. I think you'll have to evaluate machinery that is capabl
Electronics Forum | Wed May 24 11:35:15 EDT 2000 | Bill Ng
Could someone help to let me know when we are doing stencil printing of solder paste on board with OSP surface finish on the land, the stencil is resting on the solder mask or the land itself. If it is resting on the solder mask, then, the actual pas
Electronics Forum | Wed May 24 11:21:32 EDT 2000 | Travis Slaughter
Its my understanding that so long as the paste is not exposed to air it is not going to be active, someone else might be more sure about this than I am. Be ready for lots of half soldered leads using this process. Its quick and easy but will not b
Electronics Forum | Fri May 19 08:05:23 EDT 2000 | David
We do a lot of prototype work, builds occur days or months apart and moisture Absorption in IC's is a worry. I would like to bake, chuck in some silica gel and then seal or vac seal in an envelope. Does anyone have any experience of vacuum sealing wa
Electronics Forum | Fri May 19 11:10:57 EDT 2000 | Neil Peaslee
We have been having some problems with our internal mail and that must have been propagating to the web email. I managed to get that squared away last night so hopefully you don't have any more trouble with it. Thanks for keeping me on my toes. Nei
Electronics Forum | Fri May 19 14:33:30 EDT 2000 | Lawrence A. Groves
I did this at one point and found that the handleing is critical. What usually happened is that two of the PCBs would touch and the edge of one would scrape the parts off the other. I tried a couple of different epoxys and ended up with a CIBA prod
