Electronics Forum: you (Page 2701 of 3791)

Re: BGA SOLDER BALL to SURFACE PAD size relationship

Electronics Forum | Thu Feb 24 10:52:41 EST 2000 | JAX

Robert, Here's my recommendation's: Solder paste opening on screen should equal the solder mask opening on board. Stencil thickness at .008" but this should not be your main concern as stencil thickness should be determined by the fine pitch that ar

Re: Farewell to fellow old-timers and up-and-comers alike

Electronics Forum | Thu Feb 17 12:28:46 EST 2000 | Wolfgang Busko

Hi Scott, feeling sorry to hear that thing I just want to thank you like I think all do for staying with this forum (and with us) sharing your knowledge and experience for such a long time. Never forget the dreamteam ! Best wishes Wolfgang

new site - email "from" links

Electronics Forum | Mon Jan 22 12:26:37 EST 2001 | davef

Email has several columns ... "box", status, attach, from, subject, received. Why doesn't "from" show a link to the author's email address, so that you can click on that to send an email to that person? Having a link would be so much easier than op

Insulation distance

Electronics Forum | Mon Jan 22 20:13:15 EST 2001 | davef

The courtyard around a 0603 resistor should be: * 0.008" along the short edge of the component / pad * 0.036" along the long edge of the component / pad As you say, the component courtyard should be larger than the spacing between features, becaus

TO99 age and reliability

Electronics Forum | Wed Jan 24 12:42:25 EST 2001 | traviss

I�m suddenly getting a very high failure rate in a TO99 component (National LM136AH-2.5). After some investigation we found some of these parts are more than 20 years old. What I am hoping for is that someone out there can help me find some standards

PQFP with pitch of 0.4 mm

Electronics Forum | Tue Jan 30 15:30:17 EST 2001 | dason_c

Please check what is the actual pitch size. I found some of the designer use 15.7 mil pitch and no accumulate ie 15.7, 15.7 and 15.8...... Also, I recommended the pad width should be 10 - 11 mil for 0.4mm pitch. You can open the 10 - 10.5 mil aper

PQFP with pitch of 0.4 mm

Electronics Forum | Tue Jan 30 21:14:26 EST 2001 | davef

Suggestions are: * Limit pad width to 0.008" [0.2mm] * Use IPC-7525 Stencil Design Guidelines * Avoid Type 4 pastes, if you can * Slow down your print head to 0.63"/sec [16 mm/sec] * Consider the suggestions on printing by rpereira in the past

Laser trimming of resistors on PCB

Electronics Forum | Tue Jan 30 11:14:25 EST 2001 | svenson

I have an idea of trimming the resistors on a teflon PCB (FR4) after mounting and soldering. Can I use a laser to cut on a smt mounted resistor while the PCB is in functional test? The goal is to balance the resistances for a telecom application. Ha

Solder Balls

Electronics Forum | Thu Feb 01 12:50:38 EST 2001 | slthomas

I side (not that we every actually choose sides here) with the other poster re: reducing solder volume. There is a solder manufacturer that advertises regularly in trade mags. that there are "Absolutely! NONE....NIL....NADA.....mid chip beading/mic

Solder at gold finger

Electronics Forum | Thu Feb 01 20:21:34 EST 2001 | huat

Hi, Currently, we use kapton tape to tape out the goldfinger at our area. We still experience solder at goldfinger area, suspected is from washing of misprint boards. Can someone advice me on what is the method being use to clean the goldfi


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