Electronics Forum | Tue Mar 27 12:43:43 EST 2001 | kerryn
Hi Peter, Just curious, what do you have against Smart Sonic? I have heard and seen some very good things about their srencil-cleaning process. We are also still cleaning by hand, but it seems that everytime I visit another facility to evaluate new
Electronics Forum | Thu Mar 29 09:51:32 EST 2001 | larryk
Phil, I have got a couple of CR Technology machines also. We have handed off our "learning" to the operators, but you must have confidence in those people! The must be well trained! The AOI machine will flag the things it feels is "bad" and the opera
Electronics Forum | Wed Apr 11 16:02:21 EDT 2001 | stevearneson
Let me put my two cents into this argument..After being part of many extensive studies conducted to determine the benefits of solder paste inspection, there has never been a case where the customer concluded that paste inspection (Height or Volume)wa
Electronics Forum | Fri Apr 06 16:19:12 EDT 2001 | davef
We build a mixed tech [eg, QFP, SMT fly shit, DIP] board where we can't clinch the DIP. So we set the clinch and cut on the DIP to just barely clinch, leaving the leads very perpendicular to the board. I wonder if you could do something similar wit
Electronics Forum | Fri Apr 13 10:08:48 EDT 2001 | gcs
dgrenier is on the right track. We are a volume shop and with a up back stencil you can keep CFM line going with no down time. DMPO also at our shop have inproved. We also use AOI equipemnt as a process indicator to monitor when stenicls need to be c
Electronics Forum | Tue Apr 17 11:00:55 EDT 2001 | Steve
I have struggled with this myself. Usually where the pressure to clean the residue off is from the people who see the residue but do not understand the characteristics. I have not found a reason to clean residue off. A few people from our design gro
Electronics Forum | Tue Apr 17 21:05:06 EDT 2001 | davef
So, we�re talkin� �bout the smaller end of a "large" paper clip after it�s unfolded once, eh? In keeping with your "nothin� up the sleeves" full disclosure, I�ll bet you�re feelin� a little sheepish about not tellin� us about: * Antenna pad dimen
Electronics Forum | Fri Apr 20 07:12:22 EDT 2001 | wbu
Dougie, oh yes, it�s a bit short that chapter. I have the Revision e in front of me and this one contains in the appendix the needed IPC-TM-650 Test method for bow and twist. Can�t think that they don�t have that in the new revision. Hope you find
Electronics Forum | Fri Apr 20 11:05:23 EDT 2001 | gcs
Just a bullet! My results are, .005" stencil thickness should measure between .0055" - .006" if your pressure is correct, metal blades and snap-off is set up correctly. Do you have aperture reductions at the QFP locations "typicial industry standard
Electronics Forum | Fri Aug 24 09:38:17 EDT 2001 | gerits
Hi, you can use the Assembleon (Philips) ACM Micro for this. It can place Flip Chip form 0,1x0,1mm upto micro BGA, CSP's etc. etc. It even can handle Odd's and insert components. Web-site http://www.assembleon.com Please contcat me or our company o
