Electronics Forum | Fri Aug 19 01:56:53 EDT 2011 | ppcbs
I've been seeing a lot of product come in with what appears to be black pad lately. I've sent stuff out to labs to be told there is no contamination. Contamination or not solder won't wet to it. Regardless of what it is we have a method to remove
Electronics Forum | Mon Aug 22 06:30:59 EDT 2011 | janz
very often toes on the QFP packages are exposed to base material and during time they oxidize. That is why you can have problem with solder fillet. Most important is heel fillet. Regarding your misalignment of IC if this is repeatable check your pl
Electronics Forum | Wed Aug 24 12:10:20 EDT 2011 | atgservice
Hi All I need some advice , hope you guys can help. Is Juki KE750 able to mount 0201 components? Well, according to the nozzle catalogue, there is a special nozzle ( No. 149 ) which is smaller in diameter than the Nozzle 101. It says that this noz
Electronics Forum | Sat Sep 03 12:54:05 EDT 2011 | waveroom
I have sold them all and you are correct. Over the last five to eight years there has been a down turn in customer support from the big two. I would suggest Aim solder out of Rhode Island. Their service is excellent, they do provide on site assistanc
Electronics Forum | Thu Sep 01 02:51:31 EDT 2011 | zedor
HI, We currently have two SMT lines, one running leaded products and the other lead-free. There is a recommendation to combine the two to increase the line capacity. What do you think are the pros and cons, is there a risk in contamination ot the
Electronics Forum | Sat Nov 19 05:22:20 EST 2011 | davidyori
Hi Just seen your message from a few months back. Yes, i have and still do use a cosy masterpick. I think they are quite rare. I am actually selling mine, together with a massive amount of spare parts. Are you interested ? regards David
Electronics Forum | Mon Sep 12 07:03:26 EDT 2011 | mosborne1
Can you post a picture? There are many reasons why they probably don't fill. There needs to be a larger surface area on the ring on top. There could be debris in the via holes from not properly drilled or cleaned before plating process. Your customer
Electronics Forum | Tue Sep 13 04:58:57 EDT 2011 | Jacki
Dear Mosborne Thanks for your knid advice. Yap, now I posted 2 photos showing the solder condition before and after wave soldering. Just reminding, the board in the photos had been already soldering in Reflow Process. Hope, you guys will have more a
Electronics Forum | Mon Sep 19 07:34:14 EDT 2011 | henrytcx89
I would like to ask a few things about die crack. 1. I would like to know what could possibly be the root cause of die crack in die preparation? (Saw machine? Pick and Place machine?) 2. May I know how could I solve the problem? Thank you very muc
Electronics Forum | Thu Sep 22 10:28:48 EDT 2011 | davef
We agree with you. Recognize that these new solder connections have less metal and a lower standoff than similar BGA solder connections that have not been reworked. This could reduce the reliability of your product, somewhat. Flux or gel may be use
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