Electronics Forum | Wed Mar 29 02:42:21 EST 2000 | Wolfgang Busko
Michael: "C1005" stands for Capacitor 0402. For the package 0603 you need to choose "C1608". This is out of IPC-SM-782. I don�t know where it�s coming from we also deal with 0603 or 0805. IPC uses RLP-numbers (Registered Land Pattern Number) to ident
Electronics Forum | Wed Mar 29 04:34:14 EST 2000 | Marc
Micheal: Correct me if I am mistaken, but I think you have stumbled onto the age old battle between metric and imperial representations of component packaging. I have to deal with this every day as my machines are metric and the designers use imperia
Electronics Forum | Wed Mar 29 09:39:45 EST 2000 | JAX
Garo, Minor voiding in Ball Grid Array solder joints is common, and not considered a threat to reliability. The biggest cause of open solder joints caused by voids is the outgassing of moisture. They are formed when pockets of gas are trapped durin
Electronics Forum | Sat Mar 18 13:01:02 EST 2000 | Rob Fischer
As one of the exhibitors I can say that I totally agree with you. It was the best show I've been to in quite some time. We were in the main hall and the attendees came for a specific reason and weren't dissappointed. The relaxed attitude of the sh
Electronics Forum | Mon Apr 03 01:17:37 EDT 2000 | cpgoh
I ever thot of changing the whole solder pot altogether but then it prove to be a costly measures.. If looking at the source of the problem, it might be mainly due to the way that the machine had been maintain... Anyone care to share how they are per
Electronics Forum | Thu Mar 09 05:44:07 EST 2000 | Wolfgang Busko
Hi Edmund, J-STD-013 "IMPLEMENTATION of BALL GRID ARRAY and other HIGH DENSITY TECHNOLOGY" should be a great help for you. Component manufacturers ( try Motorola via Internet) also give good advice. For the DFM aspects get in contact with your asse
Electronics Forum | Thu Mar 02 18:15:01 EST 2000 | Stu Leech
How is the component marked. Is it ink marked, laser marked or what? What is the material that the marking on? What volume are you looking at? We used a small, pencil-sized sand blaster, loaded with bicarbonate of soda to errode the mark off of plast
Electronics Forum | Thu Mar 02 13:17:00 EST 2000 | Russ
Jack, a couple of questions first, 1. What pitch are these leads? 2. What are the lead footprint dimensions? 3. Orientation of component? I personally have never had much luck soldering QFPs in the wave unless they are 50 mil pitch or greater, we o
Electronics Forum | Wed Mar 01 09:34:13 EST 2000 | Sorin
HELLO, Do anybody know if is existing an empirical rule that can show me how many amps can carry a plated through hole with a diameter of x.xx millimeters? Is there a formula depending on X.XX value that could help me to make such calculations? How
Electronics Forum | Wed Mar 01 17:09:51 EST 2000 | Dave F
Gwen: Failures occur during a products life cycle, as you say. According to Reliability Analysis Center, overall factors affecting reliability are: � Maintenance shop (17%) � Hardware reliability (16%) � Retest OK (28%) � Design (21%) � Quality (18