Electronics Forum | Mon Apr 30 10:48:10 EDT 2001 | CAL
oktayunsal- Machines are your secondary problem. Knowing and understanding SMT process is your biggest obstacle. SMT process involves Electrical, Chemical, Industrial, and mechanical engineering disciplines.As a start I would begin with IPC related
Electronics Forum | Tue Nov 28 12:10:45 EST 2000 | rabell
We have a "try before you buy" rental program to let companies satisfy themselves that the materials meet their requirements. Actual customer evaluations seem to run the gamut from a decision by a quality manager that the content meets the company s
Electronics Forum | Wed Nov 29 08:33:05 EST 2000 | Dave F
No, the specific question is on the "Soldering & Rework" disk. Yours is a good approach to updates. [No lakeside baronal mansion, eh???] I have sent a list of unusual questions to Evelyn that includes the above example. It's difficult to document
Electronics Forum | Mon Nov 27 11:22:37 EST 2000 | Dave F
Please benchmark training given by electronic board assembly companies according to: * Style (eg, classroom, OJT, off-site, etc) * Type (eg, job, safety, environmental, quality, etc) * Size of company (eg sales, GT $500M, LT $500M but GT $50M, LT $50
Electronics Forum | Thu Oct 26 16:38:08 EDT 2000 | Philip A. Reyes
Hi Sir Charles! Good Day! I hope you can help me about my queries. 1. What is the acceptable misregistration or misalignment of balls after reflow soldering of PBGA module on the PCB? 2. Is there any criteria for solder ball defect or solder beads
Electronics Forum | Wed Sep 20 09:02:24 EDT 2000 | Erick Russell
The programming is simple and is based on just a few simple parameters. There is no CAD interface required to program the equipment. You must key in the dimensions of the component (X-Y and Thickness) and then specify the required thermal process.
Electronics Forum | Wed Aug 23 16:29:16 EDT 2000 | Dr. Ning-Cheng Lee
The surface tension of solder you mentioned should be referred to as interfacial tension between solder and flux. According to Antonow�s rule, the interfacial tension is the difference in surface tension of molten solder and liquid flux. Since flux a
Electronics Forum | Tue Aug 22 14:59:55 EDT 2000 | Mike Naddra
What does the reflow profile look like , the question I had was surrounding the higher reflow temperature and the max temperature that lowest thermal mass components will see. Some other questions that I had were surrounding the components , what of
Electronics Forum | Tue Aug 22 09:49:39 EDT 2000 | galltp
Dr. Lee, We have seen a small decrease in shear strength for Pb/Sn plated components attached with Sn/Ag/Cu solder compared to components with a Pb-free finish. With the jump in the cost of Pd, we are struggling to define a practical Pb-free
Electronics Forum | Thu Jul 20 16:04:22 EDT 2000 | Bob Willis
Tin/silver/copper is the alloy I have done most with and it would seem that it will be the alloy of choice if you look at the people doing the work. There are still some issues of fillet lifting which I have seen on PIHR soldering and the same in wav
