Electronics Forum | Thu Feb 11 10:59:09 EST 2010 | sumote
I am having some trouble finding an ESD safe wash basket liner. The trouble isn't finding someone who sells a product, the problem is all 3 products I have evaluated fail testing. All 3 were generators in excess of 2kv with 1 hitting over 4kv! This i
Electronics Forum | Fri Feb 19 11:17:29 EST 2010 | kpm135
When I try to load a board in our MPM UP2000 HiE I get the following error "Z axis software limit". The Z axis will move up and down freely, I re-calibrated it and reprogrammed the board and the error continues. Has anyone else run into this issue an
Electronics Forum | Tue Feb 23 16:45:36 EST 2010 | dyoungquist
Davef is right on as usual. We are doing exactly what you do. Some smt with no clean paste then the plate through connectors on our selective solder machine using water soluble flux. We then clean with a ultrasonic water process. We do see the re
Electronics Forum | Wed Mar 03 06:13:23 EST 2010 | grahamcooper22
The picture shows that the heel of the device lead is not on the pad. Either bad placement or wrong pad dimensions. I imagine most customers would reject this joint as only a small part of the lead is actually in the solder. With no heel fillet the j
Electronics Forum | Thu Mar 11 03:03:26 EST 2010 | grahamcooper22
Hi , Looking at your photo....can I also see a hole in the middle of the joint on the chip component ? Maybe its not just a problem with th ejoint son diodes ? Did you also get mid chip solder balls on chips? If so, I'd almost guarantee the pcb has t
Electronics Forum | Mon Mar 22 07:40:01 EDT 2010 | emanuel
Are you absolutely sure the problem is with the humidity? We had a problem with 3528 size leds, damaged by the pick and place nozzle because a 0.2mm mistake in the height measurement. Also, we found that several suppliers are using fake desiccant ba
Electronics Forum | Tue Mar 23 03:42:51 EDT 2010 | grahamcooper22
Hi, It is very important to follow IPC JEDEC 33 specification for storage and handing of all MSDs. In many instances defects caused by excess moisture in packages is not immediately evident (pcbs may pass final test) but when pcb has been in the fiel
Electronics Forum | Thu Mar 25 11:30:33 EDT 2010 | Sean
Hello Rajeshwara, If not mistaken, the 25% solder void specification is for BGA...As I I as know, no specification given to mosfet component yet..I think you are right, I need to look at the stencil aperture in order to reduce the air trap underneat
Electronics Forum | Fri Mar 26 00:57:05 EDT 2010 | 89jeong
Hello Sir. We also have faced a same problem. At that time, we had to repair it because we could not find any solution. But in our experience, the void underneath FET was more severe whenever we used the FET that have been made long time ago. It is
Electronics Forum | Wed Mar 24 16:54:38 EDT 2010 | stepheniii
J-STD-033B.1 Says "For cavity packages in which water may be entrpped, water clean processes after first reflow can be an additional source of moisture. This may present an additional risk, which should be evaluated." And it talks about derating if
.gif)
