Electronics Forum | Wed Nov 03 14:08:55 EDT 2010 | clampron
Good Afternoon, I would throw my vote in to Mirtec as well. I also had an opportunity quite a few years ago to compare three systems side by side. At the end of the evaluation, the Mirtec stood out over the rest. Over the past several years, I was in
Electronics Forum | Thu Jan 13 10:40:38 EST 2011 | tony_d
Good Day Michelle, If you are looking for a solid AOI system that is simple to program and extremely accurate my recommendation is MIRTEC by far. We checked out several machines and narrowed the selection down to two, YESTech and MIRTEC. We had an
Electronics Forum | Wed Dec 15 12:50:39 EST 2010 | hegemon
We evaluated Vapor Phase Reflow in 2010, and in the short time I experienced the machine, I came away with the following. The advantages you are (hopefully)already aware of, such as overall tranfer of heat to the PCB, no chance of temperature oversh
Electronics Forum | Thu Feb 10 18:18:45 EST 2011 | Anthony
I'm in the market for a low volume oven and so far I'm pretty disheartened with the availability of low volume ovens at a good price. It seems like the only high quality and reliable ovens are $3500+, which is basically out of my price range. I've
Electronics Forum | Fri Mar 04 19:38:44 EST 2011 | olddog
We are a very small (2 people) company and have recently purchased a used Quad 4c Mk II, for our low-volume in-house production. The machine appears to work perfectly for our needs. My question is regarding programming from a concept standpoint. Our
Electronics Forum | Thu Mar 17 09:53:20 EDT 2011 | rperkins
Hi Graham, I've worked in the industry selling EnSolv, Lenium, and now ENTRON solvents, which are all based on stabilized NPB. These solvents do not always clean the no lead pastes. The problem is that the pastes are becoming more like adhesives,
Electronics Forum | Fri May 13 14:08:39 EDT 2011 | eezday
This appears to be black-pad and is often the result of using specs that call for gold plating that is too thick. The black pad is corrosion that is created between the gold and electroless nickel during the gold plating process. This is counter in
Electronics Forum | Thu May 26 13:28:12 EDT 2011 | blnorman
I agree with Dave on the processing issues, but there are others: Print speed capability (do you get good deposits at various print speeds), humidity exposure (our plant did get to the high side so moisture absorption on the board/stencil was an issu
Electronics Forum | Wed Jun 15 13:40:49 EDT 2011 | hegemon
I have seen this before with larger PBGA components. When installed using a rework system, I would advise Convective rather thn IR. In my experience having high power (not high temp) convection is the only way to deal with these problematic devices
Electronics Forum | Sun Jul 24 16:10:16 EDT 2011 | davef
As a shot in the dark response to a hopelessly vague question .... Back in the old days, we'd see corrosion of metal parts after DI water washing when our water was on the high-end of the resistivity range, usually after we received fresh tanks from