Technical Articles From SPIE - International Society for Optical Engineering
Read technical articles about electronics manufacturing added by SPIE - International Society for Optical Engineering
- SMTnet
- »
- Technical Library
- »
- Contributors
- »
- Articles from SPIE - International Society for Optical Engineering
2 technical articles added by SPIE - International Society for Optical Engineering
Company Information:
Conductive Adhesives Increase Microchip Packaging Density
Jun 24, 2010 | Jakob Gakkestad, Per Dalsjo, Helge Kristiansen, Rolf Johannessen, and Maaike M.V. Taklo
Cost-effective assembly of custom-designed microelectromechanical systems (MEMS) for medium-caliber fuzes is challenging. In particular, the environment must have a setback acceleration exceeding 60,000g and centripetal acceleration of 9000g/mm out of center in a 30mm173 projectile. In addition, the space available is very limited. The traditional approach is to mount the MEMS chip in a package that is then soldered to the printed circuit board (PCB). However, by mounting the MEMS chip directly to the PCB using conductive adhesive, we can increase the packaging density while reducing manufacturing cost....
Next-Generation Test Equipment For High-Volume Wafer Production
Jun 23, 2010 | Kay Gastinger, Odd Løvhaugen
Quality control is one of the main bottlenecks in the production of micro-opto-electromechanical systems/microelectromechanical systems (MOEMS/MEMS) because each structure on a wafer is serially inspected and scanned stepwise over the entire wafer area. ...
