2 technical articles added by THALES
Apr 28, 2016 | Julien Perraud, Arnaud Grivon.
Underfilling is a long-standing process issued from the micro-electronics that can enhance the robustness and the reliability of first or second-level interconnects for a variety of electronic applications. Its usage is currently spreading across the industry fueled by the decreasing reliability margins induced by the miniaturization and interconnect pitch reduction. (...)
This paper will address the control of surface mount under filled assemblies, focusing on applicable inspection techniques and possible options to overcome their limitations....
Nov 27, 2013 | Olivier Vendier, Jean-Louis Cazaux, Jean-Luc Lortal; Thales Alenia Space.
The need in complexity for microwave space products such as active BFNs (Beam Forming Networks) is increasing, with a significantly growing number of amplitude / phase control points (number of beams * numbers of radiating elements). As a consequence, the RF component’s package topology is evolving (larger number of I/Os, interconnections densification ...) which directly affect the routing and architecture of the multilayer boards they are mounted on. It then becomes necessary to improve the density of these boards (...) This paper will present the work performed to achieve LCP-based high density multilayer structures, describing the different electrical and technological breadboards manufactured and tested and presenting the results obtained....