Electronics Manufacturing Training

Technical Articles From kurtz ersa Corporation

Read technical articles about electronics manufacturing added by kurtz ersa Corporation


2 technical articles added by kurtz ersa Corporation

Company Information:

kurtz ersa Corporation

Manufacturer of Selective Soldering Systems, Ersascope BGA Inspection Systems, BGA Rework Systems, Soldering Irons, Wave Solder and Reflow Equipment.

Wertheim, Germany

Manufacturer of Assembly Equipment, Selective Soldering, Soldering

  • Phone +49 (0) 93 42 / 80 00
  • Fax +49 (0) 93 42 / 80 01 00

kurtz ersa Corporation website

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(15) products in the catalog

(2) technical library articles

(243) news releases

BTC and SMT Rework Challenges

May 22, 2019 | Joerg Nolte

Rising customer demands in the field of PCB repair are a daily occurrence as the rapid electronic industry follows new trends in a blink of an eye. New strategies and technologies are required to fulfill those demands. Out of the long list of today's customer demands for efficient BTC and SMT PCB repair some subjects show up on a daily basis and are agreed to be relevant for the coming years:</p> <ul> <li>BTC types with new effects -> voidless treatment</li> <li>Smaller components -> miniaturization (01005 capability)</li> <li>Large board handling -> dynamic preheating for large board repair</li> <li>Repeatable processes -> flux and paste application (Dip and Print), residual solder removal (scavenging), dispensing, multiple component handling, and traceability</li> <li>Operator support -> higher automation, software guidance</li> </ul>...

Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate

Nov 08, 2017 | Viktoria Rawinski

Due to the ongoing trend towards miniaturization of power components, the need for increased thermal conductivity of solder joints in SMT processes gains more and more importance. Therefore, the role of void free solder joints in power electronics becomes more central. Voids developed during soldering reduce the actual thermal transfer and can cause thermal damage of the power components up to their failure. For this reason, the company has developed a new technique to minimize the formation of these voids during the soldering process....

Flying Probe Probe Tester with AOI

reflow oven profiler