Technical Articles From KEMET Electronics Corporation

High Temperature Ceramic Capacitors for Deep Well Applications

Jan 22, 2015 | R. Phillips, J. Bultitude, A. Gurav, K. Park, S. Murillo, P. Flores, M. Laps.

Temperature requirements for ceramic capacitors have increased significantly with recent advances in deep-well drilling technology. Increasing demand for oil and natural gas has driven the technology to deeper and deeper deposits resulting in extreme temperature environments up to 200°C and above. A novel capacitor solution utilizing temperature-stable base-metal electrode capacitors in a molded and leaded package addresses the growing market high temperature demands of (1) capacitance stability, (2) long service life, and (3) mechanical durability. A range of high temperature C0G capacitors capable of meeting this 200°C and above high temperature environment has been developed.

This paper will review the electrical, reliability, and mechanical performance of this new capacitor solution...

SMD Naked Capacitors Technologies For Severe Application Environments And Circuit Functions

Jul 07, 2011 | E.Boni, D. Montanari, L. Caliari, F. Bregoli, L. Barbieri, F. Bergamaschi

The demand for miniaturized electronic equipment and fully-automated assembly lines for mass-production of new products require the availability of a complete range of SMD components...

Soldering of SMD Film Capacitors in Practical Lead Free Processes

Jun 02, 2009 | Matti Niskala, Product Manager; Evox Rifa Group Oyj, a KEMET Company.

Today the lead free soldering process is a must in commercial electronics and it is also coming more and more important in automative and industrial electronics sectors in the near future. The most common choices for lead free solders are different Tin-Solder-Copper (SAC) alloys. Processes using SAC solders cause extra stress, because of increased process temperatures, especially to the plastic materials....

Flexible Termination - Reliability in Stringent Environments

May 21, 2009 | John Prymak, Corey Antoniades, Peter Blais, Allen Hill, Ken Lai, Mark Laps, Kevin Lynn, Reggie Phillips, Corey Riedl, Axel Schmidt, Bill Sloka, Paul Staubli; KEMET Corporation.

Failure due to board flex cracks persists as the dominant failure mode in multi-layer ceramic capacitors (MLCC). (...) This paper is intended to show the impact of temperature cycling, high-temperature life tests, and multiple bend exposures to the MLCC with this flexible termination....

Flex Crack Mitigation

Oct 23, 2008 | Bill Sloka, Ceramic Technical Consultant, KEMET Corporation

As part of continuous process improvement at KEMET, most failure modes caused by the capacitor manufacturing process have been systematically eliminated. Today these capacitor manufacturing-related defects are now at a parts per billion (PPB) level. Pareto analysis of customer complaints indicates that the #1 failure mode is IR failure due to flex cracks....

Facedown Low-Inductance Solder Pad and Via Schemes

Sep 04, 2008 | John Prymak, Erik Reed, Allen Mayar

In the quest for lower ESL devices, having the ESL reduced in the package is only half of the battle; connecting that device to the circuit determines how much of that low ESL appears to the circuit. For this low ESL part type, it would be a shame to take a part of 200 pH and add 2000 pH to its ESL because of via patterns on the PCB....