Electronics Manufacturing Training

Technical Articles From ALTER TECHNOLOGY

Read technical articles about electronics manufacturing added by ALTER TECHNOLOGY

1 technical article added by ALTER TECHNOLOGY

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A leading company in the fields of engineering, procurement and testing of high reliability components and electronic equipment within the space and other high reliability markets.

41092, Spain

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(1) technical library article

Analysis of Inspection of DPA Test Requirements Applied To Flip Chip Technologies

Jan 22, 2020 | Gonzalo Fernandez, Ana Collado

Flip chip assembly techniques bring a wide range of benefits:</p> <ul> <li>Reduced parasitic interconnection between the semiconductor die and package.</li> <li>Provides a high final assembly integrity density.</li> <li>Minimize the interconnection length, providing better electrical performances, especially for high speed signals.</li> <li>Reduce the device size and weight,…, etc.</li> </ul> <p>But there is no dedicated inspection requirements nor DPA standard which address all the necessary aspects associated to this construction type or only cover partially the topics to be inspected....

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