Technical Articles From Intertronics
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1 technical article added by Intertronics
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Potting And Encapsulating – Avoiding Voids
Aug 11, 2021 | Paul Whitehead
Formulators of multi-component adhesives, potting and encapsulation materials are careful not to supply products with entrapped air. They do this by manufacturing under vacuum or degassing them before supplying to the end user. Consequently, entrapped air in a mixed material is usually a processing issue....
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