Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


  • Reflow Ovens
  • Precision, fluid dispensing systems for low volume, high mix, R&D, and high volume 24x7 production
  • SMT Screen Printers.
  • Flexible pick & Place
  • Kyzen - PCB Cleaning

This article does not exist or has been removed.

Browse other Technical Library articles.

Add Article »

1177 SMT / PCB Assembly Related Technical Articles

Best Practices in Selecting Coatings and Pottings for Solar Panel Systems; Junction Boxes and Inverters

Aug 13, 2020 | Greg Caswell [DfR], Matt Perry [H.B. Fuller], Haichuan Zhao [H.B. Fuller], Ralph Velazquez [H.B. Fuller]

The solar industry has driven solutions that result in electronics systems that are required to perform in outside environments for over 25 years. This industry expectation has resulted in solutions to protect the electronics from failure that can result from interaction with moisture, and various chemicals leading to corrosion and shorting of the systems. Potting and encapsulation compounds can impart the very high level of protection from environmental, thermal, chemical, mechanical, and electrical conditions that the solar applications demand....

Publisher: DfR Solutions

DfR Solutions

DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry.

College Park, Maryland, USA

Service Provider

Additive Manufacturing for Next Generation Microwave Electronics and Antennas

Aug 13, 2020 | Xuanke He, Bijan K. Tehrani, Ryan A. Bahr, Manos Tentzeris

The paper will discuss the integration of 3D printing and inkjet printing fabrication technologies for microwave and millimeter-wave applications. With the recent advancements in 3D and inkjet printing technology, achieving resolution down to 50 um, it is feasible to fabricate electronic components and antennas operating in the millimeter-wave regime. The nature of additive manufacturing allows designers to create custom components and devices for specialized applications and provides an excellent and inexpensive way of prototyping electronic designs. The combination of multiple printable materials enables the vertical integration of conductive, dielectric, and semi-conductive materials which are the fundamental components of passive and active circuit elements such as inductors, capacitors, diodes, and transistors. Also, the on-demand manner of printing can eliminate the use of subtractive fabrication processes, which are necessary for conventional microfabrication processes such as photolithography, and drastically reduce the cost and material waste of fabrication....

Publisher: Georgia Institute of Technology

Georgia Institute of Technology

Center for Board Assembly Research CBAR- advanced research on board assembly processes and systems

Atlanta, Georgia, USA

School

RELIABLE NICKEL-FREE SURFACE FINISH SOLUTION FOR HIGHFREQUENCY-HDI PCB APPLICATIONS

Aug 05, 2020 | Kunal Shah, Ph.D.

The evolution of internet-enabled mobile devices has driven innovation in the manufacturing and design of technology capable of high-frequency electronic signal transfer. Among the primary factors affecting the integrity of high-frequency signals is the surface finish applied on PCB copper pads – a need commonly met through the electroless nickel immersion gold process, ENIG. However, there are well-documented limitations of ENIG due to the presence of nickel, the properties of which result in an overall reduced performance in high-frequency data transfer rate for ENIG-applied electronics, compared to bare copper. An innovation over traditional ENIG is a nickel-less approach involving a special nano-engineered barrier designed to coat copper contacts, finished with an outermost gold layer. In this paper, assemblies involving this nickel-less novel surface finish have been subjected to extended thermal exposure, then intermetallics analyses, contact/sheet resistance comparison after every reflow cycle (up to 6 reflow cycles) to assess the prevention of copper atoms diffusion into gold layer, solder ball pull and shear tests to evaluate the aging and long-term reliability of solder joints, and insertion loss testing to gauge whether this surface finish can be used for high-frequency, high density interconnect (HDI) applications....

Publisher: LiloTree

LiloTree

LiloTree is an advanced materials technology company, providing next-generation technology solutions through chemistry and materials innovations. Based in Seattle, Washington, we're an NSF funded company, manufacturer & distrib...

Redmond, Washington, USA

Manufacturer of Bare PCBs

Selection of PCB Materials for 5G

Aug 05, 2020 | John Coonrod

With the first 5G NR standard recently approved by the 3GPP at the end of 2017, many companies are racing to design 5G radio products that will demand wider bandwidths, higher frequencies, enhanced carrier aggregation and support of massive MIMO. AT&T and Samsung plan to launch 5G mobile services and Verizon plans to launch 5G Fixed Wireless Access in the US this year while South Korea will be demonstrating 5G at the upcoming Winter Olympics....

Publisher: Rogers Corporation

Rogers Corporation

Rogers' high performance laminates and bondplies are engineered to meet stringent customer requirements for 5G wireless communication, wired infrastructure, automotive radar sensors, aerospace, satellites and more.

Chandler, Arizona, USA

Manufacturer of Assembly Material, Laminates

ALD of Alumina Ceramic Films for Hermetic Protection

Aug 05, 2020 | ACI Technologies, Inc.

A primary issue in electronics reliability for military applications is the ability to ensure long term operability in harsh, extreme environments. This requires more rigid standards, such as the MIL-STD-883 (Department of Defense Test Method Standard for Microcircuits), which commercial grade electronics typically do not satisfy. A solution commonly employed is to package the critical electronic components in hermetically sealed metal or ceramic enclosures which are costly and labor intensive. Not only are the components more expensive, but the assembly process is more difficult to automate, resulting in a substantial cost premium for military grade electronics....

Publisher: ACI Technologies, Inc.

ACI Technologies, Inc.

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Philadelphia, Pennsylvania, USA

Design, IPC Standards Certification Center, Consultant, Service Provider, Training Provider

Sansui Electric X ray Component Counter

Aug 05, 2020 | Joy whatsapp wechat +8618779975930

Sansui Electric X ray Component Counter Sansui Electric Co., Ltd. is one of the world's oldest and largest audio-visual companies. Sansui Electric products have been fully involved in various fields, including notebook computers, air conditioners, traditional TVs, DVDs, and top electronic technology LEDs and LCDs. Why need Sansui Electric X ray Component Counter? The growth of the production line requires a large number of staff in the warehousing department to manage and control electronic materials, to realize timely inventory and update of material data, to prevent the lack of materials and the management and control of stagnant materials, and to provide more data for enterprise production. Basis, reduce costs. Advantage of Sansui Electric X ray Component Counter? Sansui Electric purchased the X ray component counter X7600 ( X1000 upgrade to X7600), which realized fast counting for Sansui Electric. Sansui Electric X ray Component Counter images X ray SMD counter can be used for 7-17inch Tape Reel/JEDEC Tray/IC moisture sensitive package. The speed can reach 7-12s/4 reels, and the accuracy can be as high as 99.9%. X ray counter can be connected to Sansui Electric's ERP system, and ERP can automatically Update the data so that the relevant personnel of the purchasing department and the production department can see the relevant data in a timely and effective manner, and make a production plan. Sansui Electric X ray Component Counter Youtube: https://youtu.be/gfXMi7MsZRU Hope Seamark ZM X ray SMD counter can help more " Sansui", and reach automatic warehouse management. let we let get Sansui Electric X ray Component Counter! Family of Industrial X-ray inspection machine & BGA rework station Last Article:  Foxconn x ray Next Article: BYD Electronics Xray 6600 TSI Mexico use Seamark x ray machine TDK Navitasys India X Ray case Maybe you still are interested in: Solder paste printing defects and solutions in SMT chip processing process 日本山水电气株式会社是全世界历史最悠久、规模最大的影音企业之一。 Sansui Electric产品已经全面涉及到各个领域,包括了笔记本电脑,空调,传统技术的电视,DVD,和顶尖电子技术的LED和LCD. 生产线的壮大,仓储部门需要大量的工作人员进行对电子物料的管控,实现及时的物料数据的清点和更新,以防止物料缺少,滞料的管控,以此更大化地为企业生产成本提供更多的数据依据。 Sansui Electric 采购了X ray component counter, 为Sansui Electric解决了快速counting,速度可以达到7-12s/4 reels,精准度可以高达99.9%,X ray counter可以和Sansui Electric 的ERP系统相连,实现自动更新数据的目的,让采购部,生产部等相关人员都能够及时有效的看到相关数据,做好产能计划。...

Publisher: Seamark zm Tech Group

Seamark zm Tech Group

Seamark ZM PCB BGA X-ray Inspection system Equipment -14 years experience in SMT field, Our experience will provide good solutions. X-Ray Inspection, BGA reworks tation,Full auto X ray SMD component machine

Shenzhen, China, China

Inspection

SUN &LYNN Circuits X-ray inspection equipment Application on PCB board

Aug 03, 2020 | Joy whatsapp wechat +8618779975930

SUN &LYNN Circuits X-ray inspection equipment Application on PCB board In 2020, SUN &LYNN Circuits Co., Ltd was established in Shenzhen, Guangdong and Ganzhou, Jiangxi. The production base is used for the production of PCB circuit boards. The total number of employees is 3,000. Ranked 15th among CPCA's top 100 domestically-funded circuit board companies, it has developed into a Chinese PCB manufacturing company, providing PCB, HDI, rigid-flex board, FPC and FPCBA's one-stop professional service. Quality control has always been a problem for enterprises. During PCBA assembly and processing, short circuits, voids, weak soldering, and poor contact will occur. SUN &LYNN Circuits Co., Ltd introduced X-ray to detect PCB layers and layers Alignment problem ( mulitlayer printed circuit board ). The advantages of using Seamark ZM x-ray inspection equipment are mainly reflected in: (1) The detection coverage of process defects is as high as 97%. Defects that can be inspected include: false soldering, bridge connection, monument, insufficient solder, blowholes, missing components, etc. (2) Higher test coverage. Penetrating the sample, imaging detection; (3) Test preparation time is greatly reduced. (4) Defects that cannot be reliably detected by other testing methods can be observed, such as: false welding, air holes, and poor molding. (5) Double-sided board and multi-layer board need to be checked (with layering function). (6) Provide relevant measurement information to evaluate the production process. Such as the thickness of the solder paste, the amount of solder under the solder joint, etc. Family of Industrial X-ray inspection machine & BGA rework station Last Article: Seamark ZM EeIE 2019 Next Article: Seamark ZM NEPCON Shenzhen China 2019 TSI Mexico use Seamark x ray machine Seamark ZM Productronica & NEPCON China Maybe you still are interested in: Solder paste printing defects and solutions in SMT chip processing process x-ray检测设备在PCB板的应用 近几年x-ray检测仪发展迅速,已从过去的2D检测发展到3D检测,4D检测甚至是5D检测,具有SPC统计控制功能,能够与装配设备相连,实现实时监控装配质量。采用卓茂x-ray检测设备的优势主要体现在: (1)工艺缺陷的检测覆盖率高达97%,可检查的缺陷包括:虚焊、桥连、碑立、焊料不足、气孔、器件漏装等等; (2)较高的测试覆盖度。穿透样品内部,成像检测; (3)测试的准备时间大大缩短。 (4)能观察到其他测试手段无法可靠探测到的缺陷,比如:虚焊、空气孔和成型不良等。 (5)对双面板和多层板只需一次检查(带分层功能)。 (6)提供相关测量信息,用来对生产工艺过程进行评估。如焊膏厚度、焊点下的焊锡量等。 2020年SUN &LYNN Circuits Co., Ltd成立,工厂设在广东深圳和江西赣州,生产基地用于对PCB线路板的生产,员工总人数为3000人. 在CPCA内资百强线路板企业中排名15位,已发展为中国PCB制造企业,为通讯,新能源,安防,工控,医疗,汽车等领域的全球客户提供PCB, HDI,软硬结合板,FPC和FPCBA的一站式专业服务。产品质量管控一直是企业的难题,PCBA组装加工过程中,会发现焊接不牢,接触不良的情况,SUN &LYNN Circuits Co., Ltd通过引进X-ray来检测PCB板层与层之间是否对齐。...

Publisher: Seamark zm Tech Group

Seamark zm Tech Group

Seamark ZM PCB BGA X-ray Inspection system Equipment -14 years experience in SMT field, Our experience will provide good solutions. X-Ray Inspection, BGA reworks tation,Full auto X ray SMD component machine

Shenzhen, China, China

Inspection

Aluminum Soldering - Product Guide

Jul 29, 2020 | Superior Flux and Mfg. Co.

Aluminum is a metal that it is hard to solder due to the high surface tension difference between it and molten solder alloy. This occurs because aluminum rapidly forms a tenacious oxide layer whenever it is exposed to oxygen in the air. The oxide layer is responsible for the high surface tension difference between the aluminum and the solder and impedes the solder from spreading evenly on an aluminum surface. There are hundreds of aluminum alloys available in the marketplace; it is important to identify the form of aluminum that is being soldered. Once this is done, an appropriate soldering technique can be chosen for soldering the specific aluminum alloy under consideration. Direct aluminum soldering eliminates using expensive plating techniques to prepare the aluminum surface for soldering....

Publisher: Superior Flux & Mfg. Co.

Surface Treatment Enabling Low Temperature Soldering to Aluminum

Jul 29, 2020 | Divyakant Kadiwala

TThe majority of flexible circuits are made by patterning copper metal that is laminated to a flexible substrate, which is usually polyimide film of varying thickness. An increasingly popular method to meet the need for lower cost circuitry is the use of aluminum on Polyester (Al-PET) substrates. This material is gaining popularity and has found wide use in RFID tags, low cost LED lighting and other single-layer circuits. However, both aluminum and PET have their own constraints and require special processing to make finished circuits. Aluminum is not easy to solder components to at low temperatures and PET cannot withstand high temperatures. Soldering to these materials requires either an additional surface treatment or the use of conductive epoxy to attach components. Surface treatment of aluminum includes the likes of Electroless Nickel Immersion Gold plating (ENIG), which is extensive wet-chemistry and cost-prohibitive for mass adoption. Conductive adhesives, including Anisotropic Conductive Paste (ACP), are another alternate to soldering components. These result in component substrate interfaces that are inferior to conventional solders in terms of performance and reliability. An advanced surface treatment technology will be presented that addresses all these constraints. Once applied on Aluminum surfaces using conventional printing techniques such as screen, stencil, etc., it is cured thermally in a convection oven at low temperatures. This surface treatment is non-conductive. To attach a component, a solder bump on the component or solder printed on the treated pad is needed before placing the component. The Aluminum circuit will pass through a reflow oven, as is commonly done in PCB manufacturing. This allows for the formation of a true metal to metal bond between the solder and the aluminum on the pads. This process paves the way for large scale, low cost manufacturing of Al-PET circuits. We will also discuss details of the process used to make functional aluminum circuits, study the resultant solder-aluminum bond, shear results and SEM/ EDS analysis....

Publisher: Averatek Corporation

Averatek Corporation

Averatek Corporation is a high tech company based in Santa Clara, CA that provides custom design services and patterned circuit board materials manufactured through the use of an innovative, proprietary process.

Santa Clara, California, USA

Components / Substrates

Impact of Assembly Cycles on Copper Wrap Plating

Jul 22, 2020 | Hardeep Heer, Ryan Wong, et al

The PWB industry needs to complete reliability testing in order to define the minimum copper wrap plating thickness requirement for confirming the reliability of PTH structures. Predicting reliability must ensure that the failure mechanism is demonstrated as a wear-out failure mode because a plating wrap failure is unpredictable. The purpose of this study was to quantify the effects of various copper wrap plating thicknesses through IST testing followed by micro sectioning to determine the failure mechanism and identify the minimum copper wrap thickness required for a reliable PWB. Minimum copper wrap plating thickness has become an even a bigger concern since designers started designing HDI products with buried vias, microvias and through filled vias all in one design. PWBs go through multiple plating cycles requiring planarization after each plating cycle to keep the surface copper to a manageable thickness for etching. The companies started a project to study the relationship between Copper wrap plating thickness and via reliability. The project had two phases. This paper will present findings from both Phase 1 and Phase 2....

Publisher: Firan Technology Group

Firan Technology Group

FTG is a leading North American manufacturer of high technology printed circuit boards and precision illuminated display systems.

Toronto, Ontario, Canada

Manufacturer of Assembled PCBs, Contract Manufacturer, Service Provider

Soft, Wireless Periocular Wearable Electronics For Real-Time Detection Of Eye Vergence In A Virtual Reality Toward Mobile Eye Therapies

Jul 22, 2020 | Saswat Mishra et al

Recent advancements in electronic packaging and image processing techniques have opened the possibility for optics-based portable eye tracking approaches, but technical and safety hurdles limit safe implementation toward wearable applications. Here, we introduce a fully wearable, wireless soft electronic system that offers a portable, highly sensitive tracking of eye movements (vergence) via the combination of skin-conformal sensors and a virtual reality system. Advancement of material processing and printing technologies based on aerosol jet printing enables reliable manufacturing of skin-like sensors, while the flexible hybrid circuit based on elastomer and chip integration allows comfortable integration with a user's head. Analytical and computational study of a data classification algorithm provides a highly accurate tool for real-time detection and classification of ocular motions. In vivo demonstration with 14 human subjects captures the potential of the wearable electronics as a portable therapy system, whose minimized form factor facilitates seamless interplay with traditional wearable hardware....

Publisher: Georgia Institute of Technology

Georgia Institute of Technology

Center for Board Assembly Research CBAR- advanced research on board assembly processes and systems

Atlanta, Georgia, USA

School

Via Filling Applications in Practice

Jul 15, 2020 | Stefan Keller

Via Filling • Through Hole Vias - IPC-4761 – Plugging – Filling – Filled & Capped • MicroviaFilling and Stacked Vias...

Publisher: Würth Elektronik GmbH & Co. KG

Würth Elektronik GmbH & Co. KG

We produce circuit boards from your specifications in various designs.

Niedernhall, Germany

Contract Manufacturer, Service Provider

Via In Pad - Conductive Fill or Non-Conductive Fill?

Jul 15, 2020 | Tech Talk for Techies

In the early 2000s the first fine-pitch ball grid array devices became popular with designers looking to pack as much horsepower into as small a space as possible. "Smaller is better" became the rule and with that the mechanical drilling world became severely impacted by available drill bit sizes, aspect ratios, and plating methodologies. First of all, the diameter of the drill needed to be in the 0.006" or smaller range due to the reduction of pad size and spacing pitch. Secondly, the aspect ratio (depth to diameter) became limited by drill flute length, positional accuracy, rigidity of the tools (to prevent breakage), and the throwing power of acid copper plating systems. And lastly, the plating needed to close up the hole as much as possible, which led to problems with voiding, incomplete fill, and gas/solution entrapment....

Publisher: Advanced Circuits

Advanced Circuits

One-Stop Solution for PCB & Prototype Assembly Expanded PCB manufacturing capabilities to support advanced designs with demanding requirements including laser-drilled microvias, cavity boards, heavy copper up to 20 oz., via-in-pad

Aurora, Colorado, USA

Manufacturer of Bare PCBs

Creating Reusable Manufacturing Tests for High-Speed I/O with Synthetic Instruments

Jul 08, 2020 | Louis Y. Ungar, Neil G. Jacobson, T.M. Mak

There is a compelling need for functional testing of high-speed input/output signals on circuit boards ranging from 1 gigabit per second (Gbps) to several hundred Gbps. While manufacturing tests such as Automatic Optical Inspection (AOI) and In-Circuit Test (ICT) are useful in identifying catastrophic defects, most high-speed signals require more scrutiny for failure modes that arise due to high-speed conditions, such as jitter. Functional ATE is seldom fast enough to measure high-speed signals and interpret results automatically. Additionally, to measure these adverse effects it is necessary to have the tester connections very close to the unit under test (UUT) as lead wires connecting the instruments can distort the signal. The solution we describe here involves the use of a field programmable gate array (FPGA) to implement the test instrument called a synthetic instrument (SI). SIs can be designed using VHDL or Verilog descriptions and "synthesized" into an FPGA. A variety of general-purpose instruments, such as signal generators, voltmeters, waveform analyzers can thus be synthesized, but the FPGA approach need not be limited to instruments with traditional instrument equivalents. Rather, more complex and peculiar test functions that pertain to high-speed I/O applications, such as bit error rate tests, SerDes tests, even USB 3.0 (running at 5 Gbps) protocol tests can be programmed and synthesized within an FPGA. By using specific-purpose test mechanisms for high-speed I/O the test engineer can reduce test development time. The synthetic instruments as well as the tests themselves can find applications in several UUTs. In some cases, the same test can be reused without any alteration. For example, a USB 3.0 bus is ubiquitous, and a test aimed at fault detection and diagnoses can be used as part of the test of any UUT that uses this bus. Additionally, parts of the test set may be reused for testing another high-speed I/O. It is reasonable to utilize some of the test routines used in a USB 3.0 test, in the development of a USB 3.1 (running at 10 Gbps), even if the latter has substantial differences in protocol. Many of the SI developed for one protocol can be reused as is, while other SIs may need to undergo modifications before reuse. The modifications will likely take less time and effort than starting from scratch. This paper illustrates an example of high-speed I/O testing, generalizes failure modes that are likely to occur in high-speed I/O, and offers a strategy for testing them with SIs within FPGAs. This strategy offers several advantages besides reusability, including tester proximity to the UUT, test modularization, standardization approaching an ATE-agnostic test development process, overcoming physical limitations of general-purpose test instruments, and utilization of specific-purpose test instruments. Additionally, test instrument obsolescence can be overcome by upgrading to ever-faster and larger FPGAs without losing any previously developed design effort. With SIs and tests scalable and upward compatible, the test engineer need not start test development for high-speed I/O from scratch, which will substantially reduce time and effort....

Publisher: A.T.E. Solutions

A.T.E. Solutions

A.T.E. (Advanced Test Engineering) Solutions is a leading independent test engineering consulting and educational firm.

El Segundo, California, USA

Test Services

Using Rheology Measurement As A Potentially Predictive Tool For Solder Paste Transfer Efficiency And Print Volume Consistency

Jul 02, 2020 | Mitch Holtzer, Karen Tellefsen and Westin Bent

Industry standards such as J-STD-005 and JIS Z 3284-1994 call for the use of viscosity measurement(s) as a quality assurance test method for solder paste. Almost all solder paste produced and sold use a viscosity range at a single shear rate as part of the pass-fail criteria for shipment and customer acceptance respectively. As had been reported many times, an estimated 80% of the defects associated with the surface mount technology process involve defects created during the printing process. Viscosity at a single shear rate could predict a fatal flaw in the printability of a solder paste sample. However, false positive single shear rate viscosity readings are not unknown....

Publisher: Alpha Assembly Solutions

Alpha Assembly Solutions

Alpha Assembly Solutions is a world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places.

South Plainfield, New Jersey, USA

Manufacturer of Assembly Material

101 EMI Shielding Tips and Tricks

Jul 02, 2020 | Holland Shielding Systems BV

Principle of shielding 1 The principle of shielding is creating a conductive layer completely surrounding the object you want to shield. This was invented by Michael Faraday and this system is known as a Faraday Cage. 2 Ideally, the shielding layer will be made up of conductive sheets or layers of metal that are connected by means of welding or soldering, without any interruptions. The shielding is perfect when there is no difference in conductivity between the used materials. When dealing with frequencies below 30 MHz, the metal thickness affects shielding effectiveness. We also offer a range of shielding methods for plastic enclosures. A complete absence of interruptions is not a realistic goal since the Faraday cage will have to be opened from time to time so electronics, equipment or people can be moved in or out. Openings are also needed for displays, ventilation, cooling, power supply, signals etc. 3 Shielding works in both directions, items inside the shielded room are shielded from outside influences. (Fig. 3.1)...

Publisher: Holland Shielding Systems BV

Holland Shielding Systems BV

Worldwide leading manufacturer of EMC (electromagnetic compatibility), EMI (electromagnetic interference), RFI (radio frequency interference), & EMP (electromagnetic pulse) shielding solutions. Our EMC experts will work ...

Dordrecht, Netherlands

Other

A PROCEDURE TO DETERMINE HEAD-IN-PILLOW DEFECT AND ANALYSIS OF CONTRIBUTING FACTORS

Jul 02, 2020 | Ranjit Pandher, Rahul Raut, Michael Liberatore, Navendra Jodhan, and Karen Tellefsen

Head-in-Pillow (HIP) defects are a growing concern in the electronics industry. These defects are usually believed to be the result of several factors, individually or in combination. Some of the major contributing factors include: surface quality of the BGA spheres, activity of the paste flux, improper placement / misalignment of the components, a non-optimal reflow profile, and warpage of the components. To understand the role of each of these factors in producing head-in-pillow defects and to find ways to mitigate them, we have developed two in-house tests....

Publisher: Cookson Electronics

Cookson Electronics

Leading materials science company that provides high performance materials, chemistry and technology solutions to the electronics and surface finishing industries worldwide.

Lakeville, Minnesota, USA

Manufacturer of Assembly Material

Lead-Free Risk Mitigation -- A Case Study

Jul 01, 2020 | ACI Technologies, Inc.

A company approached ACI Technologies (ACI) for assistance with a new product that was about to undergo its initial proof-of-concept prototype build. This product was an item that was being furnished to the Department of Defense for a program designed to increase the technical capabilities of computer equipment issued to the war fighter. The requirements for this item specified the use of tin-lead solder during assembly of production units. One of the main responsibilities for ACI during this project was to assist the client in mitigating the risk introduced using commercial off-the-shelf materials that may be lead-free....

Publisher: ACI Technologies, Inc.

ACI Technologies, Inc.

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Philadelphia, Pennsylvania, USA

Design, IPC Standards Certification Center, Consultant, Service Provider, Training Provider

Using Metal Core Printed Circuit Board (MCPCB) as a Solution for Thermal Management

Jun 19, 2020 | Winco K.C. Yung, PhD

The designs of electronic devices and systems are being continuously improved by becoming smaller in size and faster in communication speed. The potential risk associated with these specific design improvements will be an increase in power density and, consequently, a greater risk of thermal problems and failures. At the same time, the prevailing use of circuit boards integrated with power devices such as motor controllers and drivers, light-emitting diode (LED) lighting modules, power supplies, and amplifiers, and regulators for TV, etc., drive to the use of a proper thermal management system while designing these kinds of printed circuit board (PCB)....

Publisher: Hong Kong Polytechnic University [The]

Hong Kong Polytechnic University [The]

With 80 years of proud tradition, PolyU is a world-class research university, ranking among the world's top 100 institutions. Hong Kong Polytechnic University (PolyU) is a home for educating thinkers, communicators, and discovers.

Hung Hom, Kowloon, Hong Kong

School

COVID-19 - Managing Supply Chain Risk and Disruption

Jun 12, 2020 | Jim Kilpatrick and Lee Barter

Responding to the immediate challenge While COVID-19 may be the catalyst for companies to revisit their global supply chain strategy and accelerate the adoption of Digital Supply Network models and capabilities, short-term actions need to be made to respond to the immediate challenge....

Publisher: Deloitte

Deloitte

Deloitte Touche Tohmatsu Limited, commonly referred to as Deloitte, is a multinational professional services network. Deloitte is one of the "Big Four" accounting organizations and the largest professional services network in the

New York, New York, USA

Service Provider

Smart and Connected Bioelectronics for Seamless Health Monitoring and Persistent Human-Machine Interfaces

Jun 10, 2020 | Yun-Soung Kim and Woon-Hong Yeo

Recent advancement of flexible wearable electronics allows significant enhancement of portable, continuous health monitoring and persistent human-machine interfaces. Enabled by flexible electronic systems, smart and connected bioelectronics are accelerating the integration of innovative information science and engineering strategies, ultimately driving the rapid transformation of healthcare and medicine. Recent progress in the development and engineering of soft materials has provided various opportunities to design different types of mechanically deformable systems towards smart and connected bioelectronics....

Publisher: Georgia Institute of Technology

Georgia Institute of Technology

Center for Board Assembly Research CBAR- advanced research on board assembly processes and systems

Atlanta, Georgia, USA

School

Lead-Free Control Plan

Jun 02, 2020 | ACI Technologies, Inc.

A commercial systems manufacturer working on a major defense program contacted the Helpline for urgent assistance with an issue of failed parts during reliability testing. They were attempting to incorporate commercial off-the-shelf (COTS) computer-related hardware into a battlefield system and were experiencing reliability issues. It was noted that the parts were labeled by the vendor as "compliant to military (or MIL) standards" but not clearly identified as tin-lead or lead-free. ACI Technologies has supported a number of customers with lead-free issues and we assisted the customer in developing a short term and long-term solution to their problem....

Publisher: ACI Technologies, Inc.

ACI Technologies, Inc.

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Philadelphia, Pennsylvania, USA

Design, IPC Standards Certification Center, Consultant, Service Provider, Training Provider

7 Benefits of Choosing Professional PCB Manufacturers and Assemblers

May 28, 2020 | Allen

Properly functioning printed circuit boards are essential for both manufacturers of electronic devices and also the developers if the overall intent is for the electronic device to function at high capacity. From designing the schematics of the printed circuit boards to testing the products, there is no process of PCB manufacturing and/or assembly that can be taken for granted. While it's true that you can attempt this process on your own, especially if you are in possession of a large scale manufacturing facility, here are a few reasons why it would be a better option to opt for a professional company for PCB manufacturing and assembly. 1. Variety A professional printed circuit boards manufacturing company will be able to offer you a huge variety. You will be able to choose from rigid, flexible, or rigid-flex. What's more, the PCBs will be customized as per the need of the application. 2. Quality Professional and good printed circuit board manufacturing and assembling companies might cost you just a little bit extra but they also guarantee to produce the best results and offer very high quality products. In the end, it is quality that will make the difference between mediocre and a high functioning PCB. 3. Cost Efficiency Since you don't have to waste time or resources on buying equipment to produce the best PCBs or hiring staff to oversee the process, you can actually end up saving money. You can even save on PCB assembly cost by hiring this job out. All you have to do is to negotiate the quote and sit back, relax, and wait for the PCBs to be delivered to you. 4. Eliminate Design Flaws Design engineers hired by PCB manufacturing and assembling companies use the best graphic software to develop and test the schematics of PCBs. This increases the chances of eliminating flaws in the printed circuit boards during the initial design phase. 5. Multilayer PCB Manufacturing and Assembly The process of manufacturing and assembling multilayer PCBs is as intricate as it sounds. All processes of manufacturing and assembling multilayer PCBs require the best machines and trained technicians to pass the quality and functionality tests. Manufacturing and assembling multilayer printed circuit boards yourself is going to cost you a lot. Even the smallest of mistakes during the manufacturing and assembling process might render the entire PCB entirely useless. 6. Save Time PCBs are just a single part of the electronic device. To complete the device, many more pieces would be needed. The manufacturers of the electronic device can hire out the job of manufacturing or assembling the PCBs, which will mean they will have one less chore to do. This, in turn, will save you a lot of time which could be spent on elevating the quality of the product. 7. Experience Experience makes all the difference. It is what makes the name of any company reliable in the market. Long experience of manufacturing and assembling printed circuit boards makes the company well versed in the process and it also makes it an expert to identify design, manufacturing, assembling, and testing needs of certain applications We, at Asia Pacific Circuits, offer these benefits and so much more. For quick turn PCB assembly, PCB manufacturing and PCB designing, you can contact us anytime....

Publisher: Asia Pacific Circuits Co., Ltd

Asia Pacific Circuits Co., Ltd

Asia Pacific Circuits is one of Asia's leading Electronic Manufacturing Services companies, committed to providing high quality PCB and PCBA Contract Electronics Manufacturing Services.

Shenzhen, China

Manufacturer of Assembled PCBs, Assembly, Turnkey, Contract Manufacturer

Head-on-Pillow Defect Detection – X-ray Inspection Limitations

May 26, 2020 | Lars Bruno and Benny Gustafson

Both the number and the variants of Ball Grid Array packages (BGAs) are tending to increase on network Printed Board Assemblies (PBAs)with sizes ranging from a few mm die size Wafer Level Packages (WLPs) with low ball count up to large multi-die System-in-Package (SiP) BGAs with 60-70 mm side lengths and thousands of I/Os....

Publisher: Ericsson AB

Ericsson AB

Ericsson AB manufactures and markets radio and television communication equipment. The company was formerly known as Ericsson Radio Systems AB. Ericsson AB (Sweden) operates as a subsidiary of Ericsson.

Stockholm, Sweden

Other

1CLICKSMT Conformal Coating System -- Solution for photoelectric devices assembly

May 21, 2020 | 1clicksmt

1CLICKSMT has recently installed a conformal coating line for a photoelectric devices manufacturer in Thailand....

Publisher: 1 CLICK SMT TECHNOLOGY CO., Limited

1 CLICK SMT TECHNOLOGY CO., Limited

Manufacturer of selective soldering machine, soldering robot, reflow oven, wave solder machine, pcb handling machine. Distributing for Turnkey line include SMT line, conformal coating lines, through hole line.

Dongguan City, China

Manufacturer of Assembly Equipment, Screen Printing, Turnkey, Distributor, Selective Soldering

Pad Cratering

May 08, 2020 | ACI Technologies, Inc.

A customer contacted the Helpline to perform analysis on a lead-free assembly which exhibited intermittent functionality. The lead-free assembly exhibiting intermittent functionality when pressure was applied to the ball grid array (BGA) packages. Industrial adaptation of a Restriction of Hazardous Substances (RoHS) compliant solder standard has created a new host of failure modes observed in lead-free assemblies. Pad cratering occurs when fractures propagate along the epoxy resin layer on the underside of the BGA connecting pads. While originating from process, design, and end use conditions, it is the combination of a rigid lead-free solder with inflexible printed circuit board (PCB) laminates that has advanced the prevalence of this condition. Pad cratering is simply the result of mechanical stress exceeding material limitations....

Publisher: ACI Technologies, Inc.

ACI Technologies, Inc.

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Philadelphia, Pennsylvania, USA

Design, IPC Standards Certification Center, Consultant, Service Provider, Training Provider

Solutions for Selective Soldering of High Thermal Mass and Fine-Pitch Components

May 07, 2020 | Bob Klenke, Technical Consultant, Nordson SELECT

The selective soldering process has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty, however some types of challenging components require additional attention to ensure optimum quality control is maintained.</p> <p>Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures and/or pallets often places an additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins.</p> <p>Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors,can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues due to their beryllium copper termination pins....

Publisher: Nordson SELECT

Nordson SELECT

Selective Soldering Equipment and Solutions for Printed Circuit Board Assembly

Liberty Lake, Washington, USA

Soldering, Selective Soldering

1CLICKSMT Odd form Component inserting System -- Solution for security products assembly

Apr 29, 2020 | 1Clicksmt

1CLICKSMT has recently installed a odd form component inserting and wave soldering line for a security products manufacturer....

Publisher: 1 CLICK SMT TECHNOLOGY CO., Limited

1 CLICK SMT TECHNOLOGY CO., Limited

Manufacturer of selective soldering machine, soldering robot, reflow oven, wave solder machine, pcb handling machine. Distributing for Turnkey line include SMT line, conformal coating lines, through hole line.

Dongguan City, China

Manufacturer of Assembly Equipment, Screen Printing, Turnkey, Distributor, Selective Soldering

Flexible Bioelectronics For Physiological Signals Sensing And Disease Treatment

Apr 22, 2020 | Guang Yao, Chenhui Yin, Qian Wang, Tianyao Zhang, Sihong Chen, Chang Lu, Taisong Pan, Min Gao, Yuan Lin

Flexible bioelectronics, including wearable and implantable electronics, have revolutionized the way of human-machine interaction due to the fact that they can provide natural and seamless interactions with humans and keep stable and durable at strained states. As sensor elements or biomimetic actuators, flexible bioelectronics can dynamically sense and monitor physiological signals, reveal real-time physical health information and provide timely precise stimulations or treatments. Thus, the flexible bioelectronics are playing increasingly important roles in human-health monitoring and disease treatment, which will significantly change the future of healthcare as well as our relationships with electronics. This review summarizes recent major progress in the development of flexible substrates or encapsulation materials, sensors, circuits and energy-autonomous powers toward digital healthcare monitoring, emphasizing its role in biomedical applications in vivo and problems in practical applications. A future perspective into the challenges and opportunities in emerging flexible bioelectronics designs for the next-generation healthcare monitoring systems is also presented....

Publisher: University of Electronic Science and Technology of China

University of Electronic Science and Technology of China

UESTC is a national key multidisciplinary university specialized in electronic engineering and information science and technology with a harmonious integration of science, engineering, management and liberal arts.

Chengdu, China

School

NEWS! Independent dual Z-axis selective soldering machine

Apr 16, 2020 | 1clicksmt

Based on the dual pot, we developed an independent dual z-axis control dual pot for FLEX-i2! There are 5 operation modes available with the independent dual Z axis: only solder pot1, only solder pot2, first solder pot 1 then solder pot2, first solder pot2 then solder pot1, solder pot1 and solder pot2 together. In specific applications, solder pot1 can be selected with large nozzle soldering heat-absorbing large parts, solder pot2 use small nozzle soldering heat-absorbing small parts, so as to achieve both soldering effect and productivity. Also can use same nozzle, dual axis simultaneously solder two same plate to increase productivity. To get the maximum flexibility and productivity! FLEX-i2 is a compact in line selective soldering machine, equipped with high precision servo control system, jet valve, live-on camera, upper preheating etc, which can provide a high flexibility and efficiency soldering process. The maximum soldering size can reach 420mm*490mm!...

Publisher: 1 CLICK SMT TECHNOLOGY CO., Limited

1 CLICK SMT TECHNOLOGY CO., Limited

Manufacturer of selective soldering machine, soldering robot, reflow oven, wave solder machine, pcb handling machine. Distributing for Turnkey line include SMT line, conformal coating lines, through hole line.

Dongguan City, China

Manufacturer of Assembly Equipment, Screen Printing, Turnkey, Distributor, Selective Soldering

Reliable Selective Soldering For High Volume Assemblies

Apr 14, 2020 | Gerjan Diepstraten

The number of through hole connections on a circuit assembly are decreasing with the drive toward miniaturization. When these assemblies are manufactured in high volumes the most convenient method is selective soldering. Although selective soldering is very well introduced in automotive and industrial applications it can also be a very efficient method to solder high volume consumer products....

Publisher: ITW EAE

ITW EAE

ITW EAE is a manufacturer of equipment used in the electronic assembly and semiconductor industries. The group brings together world-class products from Camalot, Despatch, Electrovert, MPM, and Vitronics Soltec.

Lakeville, Minnesota, USA

Manufacturer of Assembly Equipment

Stencil Printing 008004/0201 Aperture Components

Apr 14, 2020 | Edward C. Nauss, Michael Butler

This paper will focus on the application requirements of solder printing small aperture designs, concentrating on 008004 (inch) / 0201 (metric) size components, and the results of a design of experiment printing these challenging apertures. As Moore's law continues to be applied to component miniaturization, the next installment of reduced packaging has arrived in the form of the 008004/0201 for resistors and capacitors. Component size roughly the size of a grain of sand presents specific challenges to the solder printing process. To address these challenges, each aspect of the printing process will need be examined. This includes essential machine requirements, including correct squeegee blades, tooling support, and calibrations, to meet the demanding specifications. The correct match and design of materials will be addressed, focusing on the stencil and substrate design along with solder paste and cleaning solvent requirements. A design of experiment will be reviewed that applies the machine and materials discussed, including the printer and Solder Paste Inspection (SPI) setup and the specific machine parameters used. The results of these DOE's will then be closely examined....

Publisher: ITW EAE

ITW EAE

ITW EAE is a manufacturer of equipment used in the electronic assembly and semiconductor industries. The group brings together world-class products from Camalot, Despatch, Electrovert, MPM, and Vitronics Soltec.

Lakeville, Minnesota, USA

Manufacturer of Assembly Equipment

Selective Solder Fine Pitch Components On High Thermal Mass Assembly

Apr 14, 2020 | Gerjan Diepstraten

The number of through-hole components on printed circuit boards (PCB) has declined significantly over the last decade. Miniaturization in electronics has resulted in less THT (through-hole technology) and leads with a finer pitch. For this reason, the soldering of these components has also changed from wave soldering to Point-to-point selective soldering. Soldering these small, fine-pitch components is a challenge when surface mount components (SMD) are positioned very close to THT components on the PCB layout. This study, done in cooperation with a large automotive EMS customer, defines the process windows for through-hole technology for fine-pitch components. It determines what is feasible to solder and defines layout design parameter that make soldering possible with SMD areas and other components on the assembly....

Publisher: ITW EAE

ITW EAE

ITW EAE is a manufacturer of equipment used in the electronic assembly and semiconductor industries. The group brings together world-class products from Camalot, Despatch, Electrovert, MPM, and Vitronics Soltec.

Lakeville, Minnesota, USA

Manufacturer of Assembly Equipment

Soft Material-Enabled, Flexible Hybrid Electronics for Medicine, Healthcare, and Human-Machine Interfaces

Apr 08, 2020 | Robert Herbert, Jong-Hoon Kim, Yun Soung Kim, HyeMoon Lee,Woon-Hong Yeo

Flexible hybrid electronics (FHE), designed in wearable and implantable configurations, have enormous applications in advanced healthcare, rapid disease diagnostics, and persistent human-machine interfaces. Soft, contoured geometries and time-dynamic deformation of the targeted tissues require high flexibility and stretchability of the integrated bioelectronics. Recent progress in developing and engineering soft materials has provided a unique opportunity to design various types of mechanically compliant and deformable systems. Here, we summarize the required properties of soft materials and their characteristics for configuring sensing and substrate components in wearable and implantable devices and systems. Details of functionality and sensitivity of the recently developed FHE are discussed with the application areas in medicine, healthcare, and machine interactions. This review concludes with a discussion on limitations of current materials, key requirements for next generation materials, and new application areas....

Publisher: Washington State Magazine

Washington State Magazine

WSM is published by the Board of Regents of Washington State University.

Pullman, Washington, USA

School

Low Temperature Soldering Using SN-BI Alloys

Apr 01, 2020 | Morgana Ribas, Ph.D., Anil Kumar, Divya Kosuri, Raghu R. Rangaraju, Pritha Choudhury, Ph.D., Suresh Telu, Ph.D., Siuli Sarkar, Ph.D.

Low temperature solder alloys are preferred for the assembly of temperature-sensitive components and substrates. The alloys in this category are required to reflow between 170 and 200oC soldering temperatures. Lower soldering temperatures result in lower thermal stresses and defects, such as warping during assembly, and permit use of lower cost substrates. Sn-Bi alloys have lower melting temperatures, but some of its performance drawbacks can be seen as deterrent for its use in electronics devices.</p><p>Here we show that non-eutectic Sn-Bi alloys can be used to improve these properties and further align them with the electronics industry specific needs. The physical properties and drop shock performance of various alloys are evaluated, and their results are analysed in terms of the alloy composition, including Bi content and alloying additions....

Publisher: Alpha Assembly Solutions

Alpha Assembly Solutions

Alpha Assembly Solutions is a world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places.

South Plainfield, New Jersey, USA

Manufacturer of Assembly Material

Product Design and Early Manufacturing Involvement

Apr 01, 2020 | ACI Technologies, Inc.

It happens much too often; manufacturing engineers are brought into a NEW product design phase at the very end of a design and are asked to provide input that should have been provided much earlier. One needs to understand how the circuit board design and quality of the manufacturing process not only effects assembly yield and product reliability, but how it could also affect the results of any testing that is done to circuit packs during prototyping. It is important that any circuit pack (including prototypes) that will be used in reliability, performance and functional testing be designed with the proper features and assembled with a manufacturing process that has been developed to produce a high-quality assembly. If not, the results of any testing might not represent the actual characteristics of the design and provide miss-guidance to future changes....

Publisher: ACI Technologies, Inc.

ACI Technologies, Inc.

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Philadelphia, Pennsylvania, USA

Design, IPC Standards Certification Center, Consultant, Service Provider, Training Provider

1Click SMT Made Successful Installation and Training For Thai Customer!

Apr 01, 2020 | 1Clicksmt

Recently, our engineer Peter went to Thailand to provide after-sales support for our customer. In these days, we had installed a SC-900 selective coating line . Moreover, Peter gave patience and meticulous training to their staff, make sure they master the machine usage .Customer and agent are satisfied with our support and give their affirmation to us. SC-900 is a high Performance 4 axis Selective Coating Machine ,which is equipped with high precision servo control system , various valves , CCD system ,material tank weight detecting system etc, which can provide a high efficiency conformal coating process .The maximum coating size can reach 400mm*450mm with SC-900. So far, we've installed several dozen conformal coating line all over the world. It have excellent stability and performance. Check below link to get more info!...

Publisher: 1 CLICK SMT TECHNOLOGY CO., Limited

1 CLICK SMT TECHNOLOGY CO., Limited

Manufacturer of selective soldering machine, soldering robot, reflow oven, wave solder machine, pcb handling machine. Distributing for Turnkey line include SMT line, conformal coating lines, through hole line.

Dongguan City, China

Manufacturer of Assembly Equipment, Screen Printing, Turnkey, Distributor, Selective Soldering

New High-Speed 3D Surface Imaging Technology in Electronics Manufacturing Applications

Mar 26, 2020 | Juha Saily

This paper introduces line confocal technology that was recently developed to characterize 3D features of various surface and material types at sub-micron resolution. It enables automatic microtopographic 3D imaging of challenging objects that are difficult or impossible to scan with traditional methods, such as machine vision or laser triangulation.<p><p>Examples of well-suited applications for line confocal technology include glossy, mirror-like, transparent and multi-layered surfaces made of metals (connector pins, conductor traces, solder bumps etc.), polymers (adhesives, enclosures, coatings, etc.), ceramics (components, substrates, etc.) and glass (display panels, etc.). Line confocal sensors operate at high speed and can be used to scan fast-moving surfaces in real-time as well as stationary product samples in the laboratory. The operational principle of the line confocal method and its strengths and limitations are discussed.</p><p>Three metrology applications for the technology in electronics product manufacturing are examined: 1. 3D imaging of etched PCBs for micro-etched copper surface roughness and cross-sectional profile and width of etched traces/pads. 2. Thickness, width and surface roughness measurement of conductive ink features and substrates in printed electronics applications. 3. 3D imaging of adhesive dots and lines for shape, dimensions and volume in PCB and product assembly applications....

Publisher: FocalSpec, Inc.

FocalSpec, Inc.

Offers bare sensors for system integration, offline benchtop tools and online scanners for metrology and inspection applications.

Santa Clara, California, USA

Inspection

DA-1200 THT automated inspection system service report

Mar 24, 2020 | 1clicksmt

Installing time : November 24 to December 2 ,2019 Participants: Customer from (Elaraby , Egypt) Service engineer:Peter (1 Click SMT)...

Publisher: 1 CLICK SMT TECHNOLOGY CO., Limited

1 CLICK SMT TECHNOLOGY CO., Limited

Manufacturer of selective soldering machine, soldering robot, reflow oven, wave solder machine, pcb handling machine. Distributing for Turnkey line include SMT line, conformal coating lines, through hole line.

Dongguan City, China

Manufacturer of Assembly Equipment, Screen Printing, Turnkey, Distributor, Selective Soldering

Robust Reliability Testing For Drop-on-Demand Jet Printing

Mar 19, 2020 | Gustaf Mårtensson, Patrik Mirzai

In this study, the question was how to perform statistically reliable robust- ness tests for the non-contact drop-on-demand printing of functional fluids, such as solder paste and conductive adhesives. The goal of this study was to develop a general method for hypothesis testing when robustness tests are performed. The main problem was to determine if there was a statistical difference between two means or proportions of jet printing devices. In this study, an example of jetting quality variation was used when comparing two jet printing ejector types that differ slightly in design. We wanted to understand if the difference in ejector design can impact jetting quality by performing robustness tests. and thus answer the question, "Can jetting differences be seen between ejector design 1 and design 2"?...

Publisher: Mycronic Technologies AB

Mycronic Technologies AB

Mycronic, formerly MYDATA, is the key manufacturer of assembly machine for electronics. Our product portfolio contains Pick&Place machines, Jet-printing machines and component storage towers.

Täby, STOCKHOLM, Sweden

Manufacturer of Assembly Equipment, Assembly, OEM

IPC Apex Expo 2020 Remarks

Mar 12, 2020 | Roland Girouard

IPC's APEX EXPO is always exciting & always fun and, most importantly, always beneficial to those who exhibit and attend. From technical conferences to standards committees to new and exciting things on the show floor - APEX 2020 was indeed a success...

Publisher: SMTnet

SMTnet

Helping businesses find each other.

Portland, Maine, USA

Other, Consultant, Marketing Agency, Publication or Online Resource, Service Provider

Filling of Microvias and Through Holes by Electrolytic Copper Plating –Current Status and Future Outlook

Mar 12, 2020 | Mustafa Özkök, Sven Lamprecht, Akif Özkök, Dolly Akingbohungbe, Moody Dreiza - Atotech Deutschland GmbH, Alex Stepinski - GreenSource Fabrication LLC

The electronics industry is further progressing in terms of smaller, faster, smarter and more efficient electronic devices. This continuous evolving environment caused the development on various electrolytic copper processes for different applications over the past several decades. (...) This paper describes the reasons for development and a roadmap of dimensions for copper filled through holes, microvias and other copper plated structures on PCBs....

Publisher: Atotech

Atotech

One of the world's leading suppliers of integrated production systems, chemistry, equipment, know-how and service for electroplating, semiconductor and printed circuit board manufacturing.

Berlin, Germany

Manufacturer of Assembly Material, Manufacturer of Components, Components / Substrates

Cleaning No-Clean Fluxes Prior to Conformal Coating

Mar 09, 2020 | ACI Technologies, Inc.

A customer called the Helpline seeking advice for cleaning no-clean fluxes prior to applying a conformal coating. The customer's assemblies were manufactured with a no-clean rosin based solder paste (ROL0) and were cleaned with an isopropyl alcohol (IPA) wash. After cleaning, a white residue was sometimes found in areas with high paste concentrations and was interfering with the adhesion of the conformal coating (Figure 1). For conformal coatings to adhere properly, the printed circuit board (PCB) surface must be clean of fluxes and other residues. In addition, ionic contamination left by flux residues can lead to corrosion and dendrite growth, two common causes of electronic opens and shorts. Other residues can lead to unwanted impedance and physical interference with moving parts....

Publisher: ACI Technologies, Inc.

ACI Technologies, Inc.

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Philadelphia, Pennsylvania, USA

Design, IPC Standards Certification Center, Consultant, Service Provider, Training Provider

Lubrication Grease Selection Guide

Mar 08, 2020 | Mike Sondalini

Lubrication Grease, use the right one for the job. Insight into lubrication classification. selection and application of greases. Compare the properties of greases and check those used in your equipment that are suited to the service....

Publisher: Business Industrial Network

Business Industrial Network

Offers training software and videos. Also, on-site training that qualify for CEUs to maintenance, engineering, and management professionals.

Las Vegas, Nevada, USA

Consultant, Publication or Online Resource, Service Provider, Software Manufacturer, Training Provider

Maintenance Policies and Procedures

Mar 08, 2020 | Larry Bush

A sample for Larry Bush's Maintenance Policies and Procedures - 2nd Edition (A 415-page book in PDF format. Those who purchase also receive 150 support files in editable format to customize and use as samples and templates.)...

Publisher: Business Industrial Network

Business Industrial Network

Offers training software and videos. Also, on-site training that qualify for CEUs to maintenance, engineering, and management professionals.

Las Vegas, Nevada, USA

Consultant, Publication or Online Resource, Service Provider, Software Manufacturer, Training Provider

IoT for Real-Time Measurement of High-Throughput Liquid Dispensing in Laboratory Environments

Mar 04, 2020 | Justin Shumate, Pierre Baillargeon, Timothy P. Spicer, and Louis Scampavia

Critical to maintaining quality control in high-throughput screening is the need for constant monitoring of liquid-dispensing fidelity. Traditional methods involve operator intervention with gravimetric analysis to monitor the gross accuracy of full plate dispenses, visual verification of contents, or dedicated weigh stations on screening platforms that introduce potential bottlenecks and increase the plate-processing cycle time.</p> <p>We present a unique solution using open-source hardware, software, and 3D printing to automate dispenser accuracy determination by providing real-time dispense weight measurements via a network-connected precision balance. This system uses an Arduino microcontroller to connect a precision balance to a local network. By integrating the precision balance as an Internet of Things (IoT) device, it gains the ability to provide real-time gravimetric summaries of dispensing, generate timely alerts when problems are detected, and capture historical dispensing data for future analysis. All collected data can then be accessed via a web interface for reviewing alerts and dispensing information in real time or remotely for timely intervention of dispense errors. The development of this system also leveraged 3D printing to rapidly prototype sensor brackets, mounting solutions, and component enclosures....

Publisher: SLAS Technology

SLAS Technology

SLAS Technology is a peer-reviewed scientific journal published by the Society for Laboratory Automation and Screening in partnership with SAGE Publications

Thousand Oaks, California, USA

Publication or Online Resource

Through-Hole Soldering Defects And The Solutions

Mar 01, 2020 | Will Bai, CTO in 1CLICK SMT

For though hole soldering, no matter it's wave soldering or selective soldering, the process is same formed by fluxing,preheating,soldering. How these 3 process will change the soldering result? When you face the soldering defects, what could be the reasons caused these and how to debug them? With below information you may get some hints....

Publisher: 1 CLICK SMT TECHNOLOGY CO., Limited

1 CLICK SMT TECHNOLOGY CO., Limited

Manufacturer of selective soldering machine, soldering robot, reflow oven, wave solder machine, pcb handling machine. Distributing for Turnkey line include SMT line, conformal coating lines, through hole line.

Dongguan City, China

Manufacturer of Assembly Equipment, Screen Printing, Turnkey, Distributor, Selective Soldering

Dispensing EMI Shielding Materials: An Alternative to Sputtering

Feb 26, 2020 | Garrett Wong, Jinu Choi

Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-inpackage (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications. However, sputtering technology challenges in scalability and cost along with advancements in dispensable materials are driving considerations for alternative dispensing techniques for EMI shielding....

Publisher: Nordson ASYMTEK

Nordson ASYMTEK

A leader in automated fluid dispensing, jetting and conformal coating. Products range from benchtop dispensers and stand-alone dispensing workstations to fully automated, in-line conveyorized systems.

Carlsbad, California, USA

Manufacturer of Assembly Equipment, Adhesives / Dispensing, Assembly, Component Packaging

Coat-and-Print Patterning of Silver Nanowires for Flexible and Transparent Electronics

Feb 19, 2020 | Weiwei Li, Azat Meredov, Atif Shamim

Silver nanowires (Ag NWs) possess excellent optoelectronic properties, which have led to many technology-focused applications of transparent and flexible electronics. Many of these applications require patterning of Ag NWs into desired shapes, for which mask-based and printing-based techniques have been developed and widely used. However, there are still several limitations associated to these techniques. These limitations, such as complicated patterning procedures, limited patterning area, and compromised optical transparency, hamper the efficient fabrication of high-performance Ag NW patterns. Here, we propose a coat-and-print approach for effectively patterning Ag NWs....

Publisher: Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab

Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab

IMPACT lab is focused on cutting-edge research in innovative antenna designs, RF circuits, and sensors.

Thuwal, Saudi Arabia

Research Institute / Laboratory

Selective protection for PCBs

Feb 18, 2020 | Scheugenpflug

Glob Top, Dam and Fill & Flit Chip Underfill To protect PCBs from damaging outside influences, they are coated with a thin layer of casting resin or protective finish during the conformal coating process. In addition to sealing the entire circuit board, it is possible to pot only sections or individual components on the substrate. Different methods ranging from "glob top" to "dam and fill" and "flip chip underfill" have been developed for this purpose....

Publisher: Scheugenpflug Inc.

Scheugenpflug Inc.

Specializes in automated metering & dispensing solutions, supplier of resin metering systems, global expert in production and process automation, vacuum dispensing production systems, and systems for dispensing of abrasive media.

Kennesaw, Georgia, USA

Manufacturer of Assembly Equipment, Adhesives / Dispensing, Assembly, Component Preparation

per page.

Pages: 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

Non-heated dispensing system

pH neutral electronics cleaning agent