Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


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955 SMT / PCB Assembly Related Technical Articles

Solder paste printing defects and solutions in SMT chip processing process

Dec 13, 2018 | Joy Rong +8618779975930

Solder paste printing defects and solutions in SMT chip processing process www.seamarkxray.com Tel: +8618779975930 Fax: 0755-29929953 Email: sales25@zhuomao.com.cn In the SMT chip processing process, solder paste printing is very complicated, and it has very important significance for product quality. This article mainly discusses the common defects of solder paste printing. 1. Incomplete printing: The solder paste has insufficient viscosity and cannot be effectively attached to the PCB or the blade is worn; Solutions: ①Replace the solder paste. When selecting the solder paste, the size of the solid metal particulates should be considered, and the particle size should be smaller than the opening size of the steel mesh; ②Regularly check and replace the scraper; 2. Solder skip, Non-wetting/false soldering: insufficient solder paste or unqualified PCB, easy to appear Solder skip, Non-wetting/false soldering; Solutions: ①Choosing a well-known manufacturer of PCB board brands can reduce the probability of PCB board failure; ②In the soldering process, ensuring the uniformity of tin and controlling the amount of tin can prevent Solder skip, Non-wetting/false soldering; ③Rough and burr of soldering: low viscosity of solder paste or rough opening of steel mesh; ④Pay attention to the viscosity of the solder paste before selecting the solder paste; In order to ensure the SMT process is good, after the SMT patch is completed, The strong enterprise will test the SMT, and the most commonly used testing equipment is the NDT X-RAY inspection equipment, which has strong penetrating power to ensure SMT 360° shows the problem of whether there is a defect....

Publisher: Seamark zm Tech Group

Seamark zm Tech Group

Seamark ZM PCB BGA X-ray Inspection system Equipment -14 years experience in SMT field, Our experience will provide good solutions. X-Ray Inspection, BGA reworks tation,Full auto X ray SMD component machine

Shenzhen, China, China

Inspection

Assembly Reliability of TSOP/DFN PoP Stack Package

Dec 12, 2018 | Reza Ghaffarian, Ph.D.

Numerous 3D stack packaging technologies have been implemented by industry for use in microelectronics memory applications. This paper presents a reliability evaluation of a particular package-on-package (PoP) that offers a reduction in overall PCB board area requirements while allowing for increases in functionality. It utilizes standard, readily available device packaging methods in which high-density packaging is achieved by: (1) using standard "packaged" memory devices, (2) using standard 3-dimensional (3-D) interconnect assembly. The stacking approach provides a high level of functional integration in well-established and already functionally tested packages. The stack packages are built from TSOP packages with 48 leads, stacked either 2-high or 4-high, and integrated into a single dual-flat-no-lead (DFN) package....

Publisher: Jet Propulsion Laboratory

Jet Propulsion Laboratory

The JPL is the lead U.S. center for robotic exploration of the solar system, and conducts major programs in space-based Earth sciences and astronomy.

Pasadena, California, USA

IPC Standards Certification Center, Training Provider

Multilayer Ceramic Capacitors: Mitigating Rising Failure Rates

Dec 05, 2018 | Dock Brown

The multilayer ceramic capacitor (MLCC) has become a widely used electronics component both for surface mount and embedded PCB applications. The MLCC technologies have gone through a number of material and process changes such as the shift from precious metal electrode (PME) configurations which were predominantly silver/palladium to base metal electrodes (BME) dominated by nickel. Each of these changes were accompanied by both quality and reliability problems. The MLCC industry is now in the midst of an unprecedented set of challenges similar to the Moore’s Law challenges being faced by the semiconductor industry. While capacitor failures have historically been responsible for a significant percentage of product field failures (most estimates are ~30%) we are seeing disturbing developments in the low voltage (<250V) commodity part infant mortality and wearout failure rates....

Publisher: DfR Solutions

DfR Solutions

DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry.

College Park, Maryland, USA

Service Provider

Process Control of Ionic Contamination Achieving 6-Sigma Criteria in The Assembly of Electronic Circuits

Nov 29, 2018 | P. Eckold, M. Routley, L. Henneken, G. Naisbitt, R. Fritsch, U. Welzel

Ionic contamination testing as a process control tool a newly developed testing protocol based on IPC-TM 650 2.3.25, was established to enable monitoring of ionic contamination within series production. The testing procedure was successfully implemented within the production of high reliability, safety critical electronic circuits, involving multiple production sites around the world. I will be shown in this paper that the test protocol is capable for meeting Six-Sigma-Criteria....

Publisher: Robert Bosch LLC Automotive Electronics Division

Robert Bosch LLC Automotive Electronics Division

Within the Bosch-Group, the Automotive Electronics Division develops, produces, and sells microelectronic products for automotive and non-automotive applications.

Stuttgart, Germany

Other

How to choose a reliable CF Card for VDR

Nov 22, 2018 | Miya

VDR (Voyage Data Recorder) is an instrument continuously recording real-time data of ship body, including speech communication signal of cockpit, sensors data, alarm status and radar images, etc.. So what's types of storage devices may meet VDR's requirement?...

Publisher: Renice Technology Co., Ltd

Renice Technology Co., Ltd

RENICE SSDs line vary on form factor, interface, MLC or SLC NAND, industrial temperature and with or without Secure erase/ Power-failure protection, AES Encryption, Write-protect function.Your best partner on storage devices.

Shenzhen, China

Manufacturer of Components

Bead probe technology - increase ICT test coverage

Nov 21, 2018 | Joy Rong +8618779975930

Bead probe technology - increase ICT test coverage www.seamarkxray.com Bead probe technology is an exclusive patent application by Agilent (Keysight Technologies). Using existing wiring to increase ICT (In-Circuit-Test) test point coverage without additional board space, to increase printing. Test points on the board to achieve assembly ICT testing can be used for ICT testing purposes. he density of the parts on the board is getting denser and denser, but the space is getting smaller and smaller, especially the board of the mobile phone. The first thing to be sacrificed is the test point that does not have any function. Many bosses think: "Quality is manufactured, As long as the quality of the board assembly is completed, there is no need for subsequent electrical testing. Which engineer can guarantee that the product does not have a bug? The assembly plant also cannot guarantee that they have zero defects in assembling the board. Various design and assembly challenges are showing that it is difficult to abandon the traditional ICT, and only other methods (such as AOI, AXI) to ensure the quality of the PCB assembly, so more and more Many companies are starting to use ICT again, but the space on the board will get smaller and smaller only, and there is room for test points, so smart Agilent came up with this kind of trace on the existing trace. The method of printing solder paste replaces the "bead probe" method of the test point. The purpose of Agilent is of course to hope that the entire electronics industry can continue to maintain ICT operations, and purchase more of its 3070 series ICT test machine from them. The traditional ICT test method uses a pointed probe to form a loop on a circular test point. This method requires a large area of test point, and then the probe must be shot like a target. , it needs to use more board space; the bead probe technology is just reversed, it wants the test point to try not to occupy the space of the board, in order to form a loop with the probe, so the solder paste is printed, let test point becomes higher, and larger diameter flat probe (50, 75, 100 mils) is used to increase the chance of contact with the test point. In theory, this is really a big breakthrough in test points, but there are still many techniques to overcome in practice. Printing solder paste on the wiring is likely to cause poor contact between the probe and the test point due to the residual flux. For this point, a number of probe manufacturers have designed probes for use with bead probes.  (Image taken from ingun)  The printing of solder paste needs to be very precise. In particular, the lead-free solder paste cohesion is worse than tin-lead solder paste, which requires more precise solder paste printing. The high tin-printing amount determines the solder height. If the soldering height at the test point is not enough, the ICT misjudgment rate will increase. . This involves the solder paste printing process, the accuracy of the steel plate, and the tolerances of the board. If the width of the wiring is too small, it is easy to be inadvertently inferred by the probe, or other external force due to insufficient adhesion. In generally, it recommended that the minimum wiring width be more than 5 mils. It is said that some operators have successfully tested 4 mils, but as the width of the wiring is smaller, the misjudgment rate of ICT is higher. It is recommended to increase the width of the wiring and then mask it with green paint, which will be stronger.   (Image taken from ingun,These beads were pressed into the shape of the probe beads with a force of 2.0 N on the left and a force of 3.0 N on the right.) Does the use of bead probe technology affect the quality of high frequencies? According to Agilent's test report, it will not affect the performance of high frequencies. Is there a capacitive or antenna effect using the bead probe technology? According to Agilent's response, there is no such problem in the current test and customer response. What is the reliability of the bead probe technology? According to Agilent's reply, there were no problems with testing 200 cycles. In addition, Agilent strongly recommends that the factory use this bead probe technology. It is best to have a test period of more than six months, because it needs to choose solder paste, fine-tuning the opening of the steel plate, the amount of solder paste, and Adjust the type and accuracy of the ICT test probe. Therefore, in the initial experiment, it is best to have both traditional round test points and new bead test points on the board....

Publisher: Seamark zm Tech Group

Seamark zm Tech Group

Seamark ZM PCB BGA X-ray Inspection system Equipment -14 years experience in SMT field, Our experience will provide good solutions. X-Ray Inspection, BGA reworks tation,Full auto X ray SMD component machine

Shenzhen, China, China

Inspection

Understanding the Effect of Different Heating Cycles on Post-Soldering Flux Residues and the Impact on Electrical Performance

Nov 20, 2018 | Brook Sandy-Smith, Indium Corporation and Terry Munson, Foresite Inc.

There are several industry-accepted methods for determining the reliability of flux residues after assembly. The recommended methods of test sample preparation do not always closely mimic the thermal cycle experienced by an assembly. Therefore, extraction from actual assemblies has become a popular method of process control to assess consistency of post-reflow cleanliness. Every method of post-reflow flux residue characterization will depend on the reflow process followed to prepare the coupon.

This investigation will focus on the effect of thermal conditions on the remainder of active ingredients in flux residues after assembly with no-clean solder pastes....

Publisher: Indium Corporation

Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Utica, New York, USA

Manufacturer of Assembly Material, Soldering

Status and Outlooks of Flip Chip Technology

Nov 14, 2018 | John H. Lau

Status of flip chip technology such as wafer bumping, package substrate, flip chip assembly, and underfill will be reviewed in this study. Emphasis is placed on the latest developments of these areas in the past few years. Their future trends will also be recommended. Finally, the competition on flip chip technology will be briefly mentioned....

Publisher: ASM Pacific Technology

ASM Pacific Technology

ASMPT is a world leader in the supply of semiconductor assembly and packaging equipment and materials as well as surface mount technology solutions.

Kwai Chung, Hong Kong

Manufacturer's Rep

SMT BGA voids Formation and prevention

Nov 13, 2018 | Joy Rong

Address: 10 Building, Huaide Cuihai Industrial Park, Fuyong Street, Bao'an, Shenzhen, China Tel: +8618779975930 E-mail: Sales25@zhuomao.com.cn Written by Joy Rong More details: www.seamarkxray.com SMT BGA voids Formation and prevention News: The 2nd China Manufacturing Technology-Automation Exhibition (CMM) & the 1st China Electronics Manufacturing Resource Exhibition (CEM) was held at the Dongguan International Convention and Exhibition, such as B&P, Anda, Huancheng, Deshen Huawei, OPPO, VIVO, Xiaomi, ZTE, Foxconn, Flextronics, Lenovo and so on, More than 500 electronic manufacturing companies participated in the exhibition. In the annual feast of the field, the realization of mobile phone production automation can reduce 60% of employees? BGA voids cause current-intensive effects and reduce the mechanical strength of the solder joint. Therefore, from the perspective of reliability, the cavity should be reduced. So how can you reduce BGA voids? There are many reasons for the formation of BGA voids, such as the crystal structure of the solder joint alloy, the design of the PCB, the deposition amount of the solder paste, the reflow soldering process used, and the voids in the soldering process. Next, we will explain the formation and prevention of BGA solder joint voids from the layer of solder paste to reduce the number of BGA solder joint void formation. 1.Furnace temperature curve is improperly set ① In the temperature rising section, the gradient is set too high, causing the rapidly escaping gas to detach the BGA from the pad; ② The duration of the heating section is not long enough. When the temperature rises, the gas that should be volatilized has not completely escaped. This part of the gas continues to escape during the reflow phase, affecting the fluxing system to play a role in the reflow phase. 2. The solder paste solvent is not properly matched ① During the heating phase, the rapidly escaping gas propels up the BGA, causing misalignment and barriers; ② During the reflow phase, a considerable amount of gas still escapes from the solder paste system, but is limited by the narrow space between the BGA and the pad. These volatile gases cannot smoothly escape through this space, causing them to be squeezed. Molten solder joints. 3. Insufficient ability of solder paste to wet the pad 4. The surface tension of the solder paste system is too high during the reflow phase 5. The solder paste system has a high non-volatile content 6. Carrier rosin quality 7. The amount of rosin used Another reason for the BGA cavity is the back-wetting phenomenon during the welding process. The formation of this phenomenon is related to the duration of action of the active material in the solder paste system and the duration of action. During the BGA reflow soldering process, BGA pads are more prone to this undesirable phenomenon than SMT solder paste soldering. After realizing these influencing factors, the corresponding testing measures were added in the research and development. For example, we introduced a thermogravimetric analyzer to conduct thermal analysis on the materials to be used and the solder paste produced, to visually understand these thermal characteristics, and to test Differences between design assumptions and actual performance, measures are taken to overcome them to ultimately meet the process requirements; and surface tension measurements are performed. The appropriate surface tension range is finally determined by measuring the surface tension of the solder paste system and its affected objects at different temperatures. Family of Industrial X-ray inspection machine & BGA rework station Last Article: SMT BGA solder ball inspection method Next Article: Detecting advantages of AOI and X-ray Inspection Equipment Maybe you still are interested in: Importance of X-ray inspection technology in the SMT FAI/ First Article Inspection Highest Quality levels Tool X-ray for industries-SMT/batteries/ceramic/Electronic /semiconductor; The difference between the detection equipment AOI & X-RAY ...

Publisher: Seamark zm Tech Group

Seamark zm Tech Group

Seamark ZM PCB BGA X-ray Inspection system Equipment -14 years experience in SMT field, Our experience will provide good solutions. X-Ray Inspection, BGA reworks tation,Full auto X ray SMD component machine

Shenzhen, China, China

Inspection

Reasons for BGA insufficient solder & short

Nov 13, 2018 | Joy Rong

Reason for BGA insufficient solder & short-There are cases of insufficient solder & solder short in BGA, and some BGA solder ball inspection methods. Written by Joy Rong Reasons for BGA insufficient solder & short There are cases of insufficient solder and solder short in BGA soldering, but it is also possible. Because the PCB BGA board has too much gap due to heat shrinkage (CTE), the edge of the BGA board is upturned. The smile curve is formed, and the circuit board is too long due to TAL (Time Above Liquidus), and the temperature difference between the upper and lower furnaces of the reflow furnace is too large, and the two-phase interaction forms a circuit board to bend down,Caused the so-called cry curve. If the cry curve, smile curve is severely deformed, short-circuit and air-welding of the BGA will be formed at the same time, which is usually the case when both occur at the same time. The picture shows that the BGA smile curve and the cry curve on the printed circuit board strongly squeeze the BGA solder balls, causing several short circuits. In general, consider reducing the slope of the reflow oven, either by preheating the BGA to eliminate thermal stress, or by requiring BGA manufacturers to use higher Tg to overcome it. Other reasons for BGA insufficient solder: 1.Circuit board pads or BGA solder balls are oxidized. In addition, printed circuit boards or BGAs with improper moisture resistance will have similar problems. 2.Solder paste expired. 3.Insufficient solder paste printing. 4.The temperature profile is poorly set, and the furnace temperature should be measured at the insufficient solder. In addition, when the temperature rises too fast, it is more likely to cause the above-mentioned cry curve, smile curve problems. 5.Design issues. For example, Via-in-pad will cause a decrease in solder paste, which may also cause the solder ball to be hollow and blow up the solder ball. 6.Head in Pillow. This phenomenon often occurs when the BGA board or printed circuit board is deformed by reflow. When the solder paste is melted, the BGA solder ball does not touch the solder paste. When cooling, the BGA carrier board and the board are deformed. Decrease, the solder ball falls back to the cured solder paste. In general, there are several methods for analyzing insufficient solder and solder short (for details, please refer:SMT BGA solder ball inspection method): 1.Microscope. 2.X-Ray inspection machine. ( Tel/whatspp/wechat +8618779975930 ) 3.Red Dye Penetration. 4.Cross section. Family of Industrial X-ray inspection machine & BGA rework station Last Article: SMT BGA solder ball inspection method Next Article: Formation and prevention of SMT BGA voids Maybe you still are interested in: As PCB designer and technician/Buyer, you do not know technologies Skills? Highest Quality levels Tool X-ray for industries-SMT/batteries/ceramic/Electronic /semiconductor; The difference between the detection equipment AOI & X-RAY More details: www.seamarkxray.com...

Publisher: Seamark zm Tech Group

Seamark zm Tech Group

Seamark ZM PCB BGA X-ray Inspection system Equipment -14 years experience in SMT field, Our experience will provide good solutions. X-Ray Inspection, BGA reworks tation,Full auto X ray SMD component machine

Shenzhen, China, China

Inspection

Laser-Based Methodology for the Application of Glass as a Dielectric and Cu Pattern Carrier for Printed Circuit Boards

Nov 07, 2018 | Joel Schrauben, Cameron Tribe, Christopher Ryder and Jan Kleinert

Glass offers a number of advantages as a dielectric material, such as a low coefficient of thermal expansion (CTE), high dimensional stability, high thermal conductivity and suitable dielectric constant. These properties make glass an ideal candidate for, among other things, package substrate and high-frequency PCB applications.

We report here a novel process for the production of printed circuit boards and integrated circuit packaging using glass as both a dielectric medium and a platform for wiring simultaneously....

Publisher: Electro Scientific Industries

Electro Scientific Industries

Captial equipment for the gobal electronics marketplace

Portland, Oregon, USA

Manufacturer of Assembly Equipment

Possible reasons for simultaneous solder skip and short circuit of BGA

Nov 07, 2018 | Rita Li --Seamark Zhuomao technology

Generally speaking, there are not many cases of insufficient solder and solder short in BGA soldering, but it is not impossible. Here we discuss some elements may cause it...

Publisher: Seamark Zhuomao Photoeletric technology(Shenzhen)CO., ltd

Seamark Zhuomao Photoeletric technology(Shenzhen)CO., ltd

We focus on SMT Inspection and repair since year 2005 and now we are largest BGA rework station manufacturer in China!We provide X-Ray Inspection System,X-ray SMD component counter,BGA Rework System, LED/LCD panel repairing

Shenzhen, China

Manufacturer of Assembly Equipment, Inspection, Repair/Rework, Tape and Reel Services, Manufacturer of Test Equipment

Study of the Rheological Behaviors of Solder Pastes

Nov 06, 2018 | Michal KRAVČÍK, Igor VEHEC

Solder paste is a homogeneous, stable suspension of solder powder particles suspended in a flux binder, and is one of the most important process materials today in surface mount technology (SMT). By varying the solder particle size, distribution and shape, as well as the other constituent materials, the rheology and printing performance of solder pastes can be controlled. Paste flow behavior is very important in defining the printing performance of any paste.

The purpose of this paper is to study the rheological behavior of SAC (Sn-Ag-Cu) solder paste used for surface mount applications in the electronic industry. The reason why the rheological tests are presented in this paper are two critical sub-processes: aperture filling and paste withdraw. In this paper, we report on the investigation of the rheological profiles, the serrated cone-to-plate system was found as effective in parameter minimizing the wall-slip effect...

Publisher: Technical University of Košice

Technical University of Košice

The principal mission of FEI TU of Košice is seen in providing education on the basis of creative research especially in such fields as electrical engineering and informatics.

Košice, Slovakia

School

High Throw DC Acid Copper Formulation for Vertical Continuous Electroplating Processes

Oct 31, 2018 | Saminda Dharmarathna, PhD, Ivan Li, PhD, Maddux Sy, Eileen Zeng, Bob Wei, William Bowerman, Kesheng Feng, PhD

The electronics industry has grown immensely over the last few decades owing to the rapid growth of consumer electronics in the modern world. New formulations are essential to fit the needs of manufacturing printed circuit boards and semiconductors. Copper electrolytes for high throwing power applications with high thermal reliability and high throughput are becoming extremely important for manufacturing high aspect ratio circuit boards.

Here we discuss innovative DC copper metallization formulations for hoist lines and VCP (Vertical Continues Plating) applications with high thermal reliability and throughput for high aspect ratio PCB manufacturing...

Publisher: MacDermid Inc.

MacDermid Inc.

MacDermid is a global provider of specialty chemicals for the most complex printed circuit board designs. We specialize in the areas of final finishes, through-hole metallization, and circuit formation.

Waterbury, Connecticut, USA

Manufacturer of Assembly Material, Antistatic

QPlan - NPI Tools included

Oct 29, 2018 | Alexei Shkolnik from Proventus Technologies

We found that NPI process of SMT is mostly similar and sometimes overlapping to tooling process. In addition, in most cases the programmer is part of the team working on the NPI process. So, QPlan was extended with NPI Tools as a part of tooling process. This allows the team to carry out the NPI process at offline. And at the end of it, they can create corrected SMT program at zero time....

Publisher: Proventus Technologies

Proventus Technologies

Proventus has proven experience in creating software tools for the Electronic and Mechanic Manufacturing Industry in Israel and Canada.

Petah-Tikva, Israel

Software Manufacturer

Rosin Resins Solution for Soldering Industry

Oct 26, 2018 | Jack Su

A product whitepaper of modified resins for soldering industry....

Publisher: Foreverest Resources Ltd.

Foreverest Resources Ltd.

Foreverest™ supply materials for manufacture of defluxing, fluxes, adhesives, pastes and cleaning agents based on gum rosin derivatives.

Xiamen, China

Other, Adhesives/Dispensing, OEM

Durable Conductive Inks and SMD Attachment for Robust Printed Electronics

Oct 24, 2018 | Leonard Allison

Polymer Thick Film (PTF)-based printed electronics (aka Printed Electronics) has improved in durability over the last few decades and is now a proven alternative to copper circuitry in many applications once thought beyond the capability of PTF circuitry. This paper describes peak performance and areas for future improvement.

State-of-the-art PTF circuitry performance includes the ability to withstand sharp crease tests, 85C/85%RH damp heat 5VDC bias aging (silver migration), auto seat durability cycling, SMT mandrel flexing, and others. The IPC/SGIA subcommittee for Standards Tests development has adopted several ASTM test methods for PTF circuitry and is actively developing needed improvements or additions. These standards are described herein. Advantages of PTF circuitry over copper include: varied conductive material compositions, lower cost and lower environmental impact. Necessary improvements include: robust integration of chip and power, higher conductivity, and fine line multi-layer patterning....

Publisher: Engineered Materials Systems, Inc.

Engineered Materials Systems, Inc.

A global manufacturer of adhesives, conductives and encapsulants. For over 20 years, EMS has formulated state of the art acrylics, epoxies, silicones and urethanes.

Delaware, Ohio, USA

Manufacturer of Assembly Material

SMT Troubleshooting Guide

Oct 20, 2018 | Cookson Electronics

With this easy-to-use Troubleshooting Guide, you can learn to troubleshoot common SMT issues. After using it a few times, it will become an essential companion for you and anyone in your company responsible for operating an SMT line.

This Guide offers troubleshooting advice for common SMT assembly issues by process defect. If your issue is not resolved after following the steps to help identify the possible root cause and solution, please contact your Cookson Electronics representative who will be able to provide you with further assistance....

Publisher: Cookson Electronics

Cookson Electronics

Leading materials science company that provides high performance materials, chemistry and technology solutions to the electronics and surface finishing industries worldwide.

Providence, Rhode Island, USA

Manufacturer of Assembly Material

Analysis of the Design Variables of Thermoforming Process on the Performance of Printed Electronic Traces

Oct 18, 2018 | Gill M., Gruner A., Ghalib N., Sussman M., Avuthu S., Wable G, Richstein J.

One specific market space of interest to emerging printed electronics is In Mold Label (IML) technology. IML is used in many consumer products and white good applications. When combined with electronics, the In Mold Electronics (IME) adds compelling new product functionality. Many of these products have multi-dimensional features and therefore require thermoforming processes in order to prepare the labels before they are in-molded. While thermoforming is not a novel technique for IML, the addition of printed electronic functional traces is not well documented. There is little or no published work on printed circuit performance and design interactions in the thermoforming process that could inform improved IME product designs. A general full factorial Design of Experiments (DOE) was used to analyze the electrical performance of the conductive silver ink trace/polycarbonate substrate system. Variables of interest include trace width, height of draw, and radii of both top and bottom curvatures in the draw area. Thermoforming tooling inserts were fabricated for eight treatment combinations of these variables. Each sample has one control and two formed strips. Electrical measurements were taken of the printed traces on the polymer sheets pre- and post- forming with a custom fixture to evaluate the effect on resistance. The design parameters found to be significant were draw height and bottom radius, with increased draw and smaller bottom curvature radii both contributing to the circuits’ resistance degradation. Over the ranges evaluated, the top curvature radii had no effect on circuit resistance. Interactions were present, demonstrating that circuit and thermoforming design parameters need to be studied as a system. While significant insight impacting product development was captured further work will be executed to evaluate different ink and substrate material sets, process variables, and their role in IME....

Publisher: Jabil Circuit, Inc.

Jabil Circuit, Inc.

An electronic product solutions company providing comprehensive electronics design, manufacturing and product management services.

St. Petersburg, Florida, USA

Design, Service Provider

3D Printed Electronics for Printed Circuit Structures

Oct 10, 2018 | Samuel LeBlanc, Paul Deffenbaugh, Jacob Denkins, Kenneth Church

Printed electronics is a familiar term that is taking on more meaning as the technology matures. Flexible electronics is sometimes referred to as a subset of this and the printing approach is one of the enabling factors for roll to roll processes. Printed electronics is improving in performance and has many applications that compete directly with printed circuit boards. The advantage of roll to roll is the speed of manufacturing, the large areas possible, and a reduction in costs. As this technology continues to mature, it is also merging with the high profile 3D printing. (...)

This paper will show working demonstrations of printed circuit structures, the obstacles, and the potential future of 3D printed electronics....

Publisher: nScrypt Inc.

nScrypt Inc.

nScrypt provides precision micro-dispensing and 3D printing equipment with unmatched precision and quality

Orlando, Florida, USA

Manufacturer of Assembly Equipment

Fill the Void II: An Investigation into Methods of Reducing Voiding

Oct 03, 2018 | Tony Lentz - FCT Assembly, Patty Chonis, JB Byers - A-Tek Systems

Voids in solder joints plague many electronics manufacturers. Do you have voids in your life? We have good news for you, there are many excellent ways to "Fill the Void." This paper is a continuation of previous work on voiding in which the following variables were studied: water soluble lead-free solder pastes, a variety of stencil designs, and reflow profiles. Quad Flat No-Lead (QFN) component thermal pads were used as the test vehicle. The voiding results were summarized and recommendations were made for reduction of voiding....

Publisher: FCT ASSEMBLY, INC.

FCT ASSEMBLY, INC.

With numerous facilities in the United States, we are one of the electronics industry's leading manufacturers of lead-free solder products, superior quality stencils, and precision cut parts.

Greeley, Colorado, USA

Manufacturer of Assembly Material, Soldering

Assessing the Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction

Sep 26, 2018 | Carlos Tafoya, Gustavo Ramirez, Timothy O’Neill

Bottom terminated components, or BTCs, have been rapidly incorporated into PCB designs because of their low cost, small footprint and overall reliability. The combination of leadless terminations with underside ground/thermal pads have presented a multitude of challenges to PCB assemblers, including tilting, poor solder fillet formation, difficult inspection and – most notably – center pad voiding. Voids in large SMT solder joints can be difficult to predict and control due to the variety of input variables that can influence their formation. Solder paste chemistries, PCB final finishes, and reflow profiles and atmospheres have all been scrutinized, and their effects well documented. Additionally, many of the published center pad voiding studies have focused on optimizing center pad footprint and stencil aperture designs. This study focuses on I/O pad stencil modifications rather than center pad modifications. It shows a no-cost, easily implemented I/O design guideline that can be deployed to consistently and repeatedly reduce void formation on BTC-style packages....

Publisher: AIM Solder

AIM Solder

AIM is a leading global manufacturer of tin-lead and lead-free solder assembly materials for the electronics industry.

Montreal, Quebec, Canada

Manufacturer of Assembly Material, Soldering

Moisture Measurements in PCBs and Impact of Design on Desorption Behaviour

Sep 21, 2018 | Chris Hunt, Owen Thomas, Martin Wickham

Moisture accumulates during storage and industry practice recommends specific levels of baking to avoid delamination. This paper will discuss the use of capacitance measurements to follow the absorption and desorption behaviour of moisture. The PCB design used in this work, focused on the issue of baking out moisture trapped between copper planes. The PCB was designed with different densities of plated through holes and drilled holes in external copper planes, with capacitance sensors located on the inner layers. For trapped volumes between copper planes, the distance between holes proved to be critical in affecting the desorption rate. For fully saturated PCBs, the desorption time at elevated temperatures was observed to be in the order of hundreds of hours. Finite difference diffusion modelling was carried out for moisture desorption behaviour for plated through holes and drilled holes in copper planes. A meshed copper plane was also modelled evaluating its effectiveness for assisting moisture removal and decreasing bake times. Results also showed, that in certain circumstances, regions of the PCB under copper planes initially increase in moisture during baking....

Publisher: National Physical Laboratory

National Physical Laboratory

NPL is the UK's National Measurement Institute, and a world-leading centre of excellence in developing and applying the most accurate measurement standards, science and technology available.

Middlesex, United Kingdom

School

Supply Chain Security: DFARS - Detection & Avoidance of Counterfeit Electronic Parts

Sep 19, 2018 | Robert S. Metzger

Coverage

  • The threat of counterfeit electronics
  • The statute - Section 818 NDAA FY 2012
  • The DFARS – Detection & Avoidance of Counterfeit Electronic Parts – Revised August 2016
...

Publisher: Rogers Joseph O’Donnell, P.C.

Rogers Joseph O’Donnell, P.C.

RJO is a litigation boutique with a national reputation built on the experience, expertise, and energy of its attorneys.

Washington, District of Columbia, USA

Other

Counterfeit Electronic Components Identification: A Case Study

Sep 12, 2018 | Martin Goetz, Ramesh Varma

Counterfeit electronic components are finding their way into today’s defense electronics. The problem gets even more complex when procuring DMS (diminishing manufacturing source) parts. This paper will provide a brief introduction to counterfeit prevention and detection standards, particularly as they relate to the Aerospace and Defense sector. An analysis of industry information on the types and nature of counterfeit components will be discussed in order to illustrate those most likely to be counterfeited, followed a specific case at a major defense contractor....

Publisher: Northrop Grumman Corporation

Northrop Grumman Corporation

Northrop Grumman is a global aerospace and defense technology company providing innovative systems, products and solutions to government and commercial customers.

Blacksburg, Virginia, USA

Other

Moisture and Bubble-Free Material Preparation in Larger Quantities

Sep 10, 2018 | Scheugenpflug

Issue: Moisture and bubbles in your dispensing material with larger quantities Solution: Scheugenpflug’s 55-gal Barrel Agitator Station Barrel agitators for casting resins take their technology from the paint sector. They fall short of meeting the special demands of the auto, medical, aeronautics and electronics industries. They can’t guarantee a solid seal on the barrels – often containing expensive, moisture sensitive resins – allowing the humidity of the surrounding environment to damage the material. Also, conventional barrel agitators, as opposed to smaller units, cannot work in a vacuum to process materials directly....

Publisher: Scheugenpflug Inc.

Scheugenpflug Inc.

Specializes in automated metering & dispensing solutions, supplier of resin metering systems, global expert in production and process automation, vacuum dispensing production systems, and systems for dispensing of abrasive media.

Kennesaw, Georgia, USA

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Assembly

Improved Flux Reliability of Lead-Free Solder Alloy Solder Paste Formulated with Rosin and Anti-Crack Resin for Automotive and Other High Reliability Applications

Sep 05, 2018 | Shantanu Joshi, Jasbir Bath, Mitsuyasu Furusawa, Junichi Aoki, Roberto Garcia, Manabu Itoh

In recent years, a growing number of electronic devices are being incorporated into automotive and other high reliability end products where the challenge is to make these devices more reliable. The package size of the devices is largely driven by the consumer industry with their sizes getting smaller making it harder to assemble and be reliable at the same time. For automotive and other high reliability electronics product, it is of the utmost priority to secure high reliability because it directly involves human life and safety. Challenges include selecting an appropriate solder alloy and having good reliability of the solder paste flux....

Publisher: Koki Company LTD

Koki Company LTD

Suppliers of solder pastes, wave soldering liquid fluxes and SMT adhesives and cored solder wires for all soldering requirements.

Tokyo , Japan

Manufacturer of Assembly Material, Adhesives/Dispensing, Soldering

Does Thermal Cycling Impact the Electrical Reliability of a No-Clean Solder Paste Flux Residue

Aug 29, 2018 | Eric Bastow

No-clean solder pastes are widely used in a number of applications that are exposed to wide variations in temperature during the life of the assembled electronics device. Some have observed that cracks can and do form in flux residue and have postulated that this is the result of or exacerbated by temperature cycling. Furthermore, the potential exists for the flux residue to soften or liquefy at elevated temperatures, and even flow if orientated parallel to gravity. In situations such as in automotive electronics, where significant temperature cycling is a reality and high reliability is a must, concern sometimes exists that the cracking and possible softening or liquefying of the residue may have a deleterious effect on the electrical reliability of the flux residue. This paper will attempt to address this concern....

Publisher: Indium Corporation

Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Utica, New York, USA

Manufacturer of Assembly Material, Soldering

To dispense material under vacuum or dispense degassed material in atmosphere ….that is the question

Aug 23, 2018 | Scheugenpflug

Simply put, the proper system design and use of vacuum in the potting process can make the difference between a mediocre part and a perfect part. Air entrapment is inevitable whether you utilize syringes, cartridges, pails, or drums of material in the process....

Publisher: Scheugenpflug Inc.

Scheugenpflug Inc.

Specializes in automated metering & dispensing solutions, supplier of resin metering systems, global expert in production and process automation, vacuum dispensing production systems, and systems for dispensing of abrasive media.

Kennesaw, Georgia, USA

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Assembly

Board-Level Thermal Cycling and Drop-Test Reliability of Large, Ultrathin Glass BGA Packages for Smart Mobile Applications

Aug 22, 2018 | Bhupender Singh, Gary Menezes, Scott McCann, Vidya Jayaram, Urmi Ray, Venky Sundaram, Raj Pulugurtha, Vanessa Smet, Rao Tummala

Glass substrates are emerging as a key alternative to silicon and conventional organic substrates for high-density and high-performance systems due to their outstanding dimensional stability, enabling sub-5-µm lithographic design rules, excellent electrical performance, and unique mechanical properties, key in achieving board-level reliability at body sizes larger than 15 × 15 mm2.

This paper describes the first demonstration of the board-level reliability of such large, ultrathin glass ball grid array (BGA) packages directly mounted onto a system board, considering both their thermal cycling and drop-test performances....

Publisher: Institute of Electrical and Electronics Engineers (IEEE)

Institute of Electrical and Electronics Engineers (IEEE)

IEEE is the world's largest professional association dedicated to advancing technological innovation and excellence for the benefit of humanity.

Piscataway, New Jersey, USA

Association, Non-Profit

Demystifying Adhesive Dispensing within the High-End Appliance Industry

Aug 16, 2018 | Jason Smith, Sebastian Wagner, and Robert Muscat, Sales Engineers at Scheugenpflug Inc.

Appliance designers are constantly evolving to satisfy the ever changing wants and needs of their consumer base. These changes filter down and include not only the materials but also the equipment used to dispense the material in the manufacturing processes. Moreover, the latest evolution of appliances also seeks to add luxury controls and eye-catching applications. This challenge then, of new applications and material dispensing, often means the application and execution of these increasingly complex materials present multiple challenges up and down the appliance supply chain. Successfully meeting the material dispensing challenge has the potential to spur growth significantly in the higher-end appliance industry as the manufacturing adhesion processes evolve to meet market demand....

Publisher: Scheugenpflug Inc.

Scheugenpflug Inc.

Specializes in automated metering & dispensing solutions, supplier of resin metering systems, global expert in production and process automation, vacuum dispensing production systems, and systems for dispensing of abrasive media.

Kennesaw, Georgia, USA

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Assembly

Reliable Young's Modulus Value of High Flexible, Treated Rolled Copper Foils Measured by Resonance Method

Aug 15, 2018 | Kazuki Kammuri, Atsushi Miki, Hiroki Takeuchi

Smartphones and tablets require very high flexibility and severe bending performance ability of the flexible printed circuits (FPCs) to fit into their thinner and smaller body designs. In these FPCs, the extraordinary highly flexible, treated rolled-annealed (RA) copper foils have recently used instead of regular RA foil and electro deposited foils. It is very important to measure the Young's moduli of these foils predicting the mechanical properties of FPCs such as capabilities of fatigue endurance, folding, and so on. Even though the manufacturers use IPC TM-650 2.4.18.3 test method for measuring Young's modulus of copper foils over many years, where Young's modulus is calculated from the stress–strain (S–S) curve, it is quite difficult to obtain the accurate Young's modulus of metal foils by this test method....

Publisher: JX Nippon Mining & Metals

JX Nippon Mining & Metals

JX Nippon engages in the development of non-ferrous metals that include copper, gold, and silver. It also manufactures electro-deposited and treated rolled copper foils that are used in PCBs.

Tokyo, Japan

Manufacturer of Assembly Material

New Phosphorus-based Curing Agents for PWB

Aug 08, 2018 | A. Piotrowski, M. Zhang, S. Levchik - ICL-IP, Y. Zilberman, Eran Gluz - IMI

As a result of the continuous industrial trend towards high density packaging there is a growing demand for highly thermally-stable laminate materials. Although the epoxy resin defines the thermal stability, often the flame retardant used becomes the limiting factor in achieving a higher stability. Recognizing this industrial need, the company has developed a new flame-retardant curing agent, Material A. This is a phosphorus-based polymer which cures epoxy via a very specific mechanism. Common Novolac epoxy resins cured with Material A and a phenol-formaldehyde resin show a Tg >180 °C and Td >400 °C. In addition to a high thermal stability, Material A also shows a dielectric loss factor lower than commercial phosphorus-based flame retardants....

Publisher: ICL-IP

ICL-IP

ICL Industrial Products (IP) is the world's largest bromine producer.

St. Louis, Missouri, USA

Other

Best Practices for Improving the PCB Supply Chain: Performing the Process Audit

Aug 03, 2018 | Greg Caswell, Dr. Craig Hillman

In the electronics industry, the quality and reliability of any product is highly dependent upon the capabilities of the manufacturing suppliers. Manufacturing defects are one of the top reasons why companies fail to meet warranty expectations. These problems can result in severe financial pain and eventual loss of market share. What a surprising number of engineers and managers fail to realize is that focusing on processes addresses only part of the issue. Supplier selection also plays a critical role in the success or failure of the final product....

Publisher: DfR Solutions

DfR Solutions

DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry.

College Park, Maryland, USA

Service Provider

Early Design Review of Boundary Scan in Enhancing Testability and Optimization of Test Strategy

Aug 01, 2018 | Sivakumar Vijayakumar

With complexities of PCB design scaling and manufacturing processes adopting to environmentally friendly practices raise challenges in ensuring structural quality of PCBs. This makes it essential to have a good 'Design for Test' (DFT) to ensure a robust structural test. (...)

During the course of the DFT review, can we realize a good test strategy for the PCBA. How can the test strategy of the PCBA be partitioned as to what portions of the design can be covered structurally and what is covered functionally, in a way that provides best diagnostics to discover faults...

Publisher: Keysight Technologies

Keysight Technologies

A global electronic measurement technology and market leader helping to transform its customers' measurement experience through innovations in wireless, modular, and software solutions.

Santa Rosa, California, USA

Inspection, Test Services

Expanding IEEE Std 1149.1 Boundary-Scan Architecture Beyond Manufacturing Test of Printed Circuit Board Assembly

Jul 25, 2018 | Jun Balangue

This paper will discuss the expanded use of boundary-scan testing beyond the typical manufacturing test to capture structural defects on a component/devices in a printed circuit board assembly (PCBA). The following topics will be discussed to demonstrate the capability of boundary-scan test system on how we can extend beyond typical manufacturing test: Boundary-scan as a complete manufacturing test system, Boundary-scan implementation during PCBA design stage, Implementation of boundary-scan beyond typical structural testing...

Publisher: Keysight Technologies

Keysight Technologies

A global electronic measurement technology and market leader helping to transform its customers' measurement experience through innovations in wireless, modular, and software solutions.

Santa Rosa, California, USA

Inspection, Test Services

Improve SMT Assembly Yields Using Root Cause Analysis in Stencil Design

Jul 18, 2018 | Greg Smith

Reduction of first pass defects in the SMT assembly process minimizes cost, assembly time and improves reliability. These three areas, cost, delivery and reliability determine manufacturing yields and are key in maintaining a successful and profitable assembly process. It is commonly accepted that the solder paste printing process causes the highest percentage of yield challenges in the SMT assembly process. As form factor continues to get smaller, the challenge to obtain 100% yield becomes more difficult.

This paper will identify defects affecting SMT yields in the printing process and discuss their Root Cause. Outer layer copper weight and surface treatment will also be addressed as to their effect on printability. Experiments using leadless and emerging components will be studied and root cause analysis will be presented...

Publisher: FCT ASSEMBLY, INC.

FCT ASSEMBLY, INC.

With numerous facilities in the United States, we are one of the electronics industry's leading manufacturers of lead-free solder products, superior quality stencils, and precision cut parts.

Greeley, Colorado, USA

Manufacturer of Assembly Material, Soldering

Improving Thermal Cycle and Mechanical Drop Impact Resistance of a Lead-free Tin-Silver-Bismuth-Indium Solder Alloy with Minor Doping of Copper Additive

Jul 11, 2018 | Takehiro Wada, Seiji Tsuchiya, Shantanu Joshi, Roberto Garcia, Kimiaki Mori, Takeshi Shirai

For a demanding automotive electronics assembly, a highly thermal fatigue resistant solder alloy is required, which makes the lead-free Sn-Ag-Cu type solder alloy unusable. Sn-Ag-Bi-In solder alloy is considered as a high reliability solder alloy due to significant improvement in thermal fatigue resistance as compared to a standard Sn-Ag-Cu alloy. The alloy has not only good thermal fatigue properties but it also has superior ductility and tensile strength by appropriate addition of In; however, initial results indicated a sub-par performance in joint reliability when it is soldered on a printed circuit board (PCB) with Electroless Nickel Immersion Gold (ENIG) surface finish. Numerous experiments were performed to find out appropriate alloying element which would help improve the performance on ENIG PCBs. Sn-Ag-Bi-In solder alloys with and without Cu additions were prepared and then tests were carried out to see the performance in a thermal fatigue test and a drop resistance test.to investigate the impact of Cu addition towards the improvement of joint reliability on ENIG finish PCB. Also, the mechanism of such improvement is documented....

Publisher: Koki Company LTD

Koki Company LTD

Suppliers of solder pastes, wave soldering liquid fluxes and SMT adhesives and cored solder wires for all soldering requirements.

Tokyo , Japan

Manufacturer of Assembly Material, Adhesives/Dispensing, Soldering

Inkjet-Printed and Paper-Based Electrochemical Sensors

Jul 03, 2018 | Ryan P. Tortorich, Hamed Shamkhalichenar, Jin-Woo Choi

It is becoming increasingly more important to provide a low-cost point-of-care diagnostic device with the ability to detect and monitor various biological and chemical compounds. Traditional laboratories can be time-consuming and very costly. Through the combination of well-established materials and fabrication methods, it is possible to produce devices that meet the needs of many patients, healthcare and medical professionals, and environmental specialists. Existing research has demonstrated that inkjet-printed and paper-based electrochemical sensors are suitable for this application due to advantages provided by the carefully selected materials and fabrication method. Inkjet printing provides a low cost fabrication method with incredible control over the material deposition process, while paper-based substrates enable pump-free microfluidic devices due to their natural wicking ability. Furthermore, electrochemical sensing is incredibly selective and provides accurate and repeatable quantitative results without expensive measurement equipment. By merging each of these favorable techniques and materials and continuing to innovate, the production of low-cost point-of-care sensors is certainly within reach...

Publisher: Louisiana State University

Louisiana State University

LSU is the flagship university for Louisiana, supporting land, sea and space grant research.

Baton Rouge, Louisiana, USA

School

Flexible Hybrid Circuit Fully Inkjet-Printed: Surface Mount Devices Assembled By Silver Nanoparticles-Based Inkjet Ink

Jun 27, 2018 | J. Arrese, G. Vescio, E. Xuriguera, B. Medina-Rodriguez, A. Cornet, and A. Cirera

Nowadays, inkjet-printed devices such as transistors are still unstable in air and have poor performances. Moreover, the present electronics applications require a high degree of reliability and quality of their properties. In order to accomplish these application requirements, hybrid electronics is fulfilled by combining the advantages of the printing technologies with the surface-mount technology.

In this work, silver nanoparticle-based inkjet ink (AgNP ink) is used as a novel approach to connect surface-mount devices (SMDs) onto inkjet-printed pads, conducted by inkjet printing technology...

Publisher: Universitat de Barcelona

Universitat de Barcelona

With 73 undergraduate programs, 273 graduate programs and 48 doctorate programs to over 63,000 students, UB is considered to be the best university in Spain in the QS World University Rankings of 2018.

Barcelona, Spain

School

Design for Testability (DFT) to Overcome Functional Board Test Complexities in Manufacturing Test

Jun 20, 2018 | Louis Y. Ungar

Manufacturers test to ensure that the product is built correctly. Shorts, opens, wrong or incorrectly inserted components, even catastrophically faulty components need to be flagged, found and repaired. When all such faults are removed, however, functional faults may still exist at normal operating speed, or even at lower speeds. Functional board test (FBT) is still required, a process that still relies on test engineers’ understanding of circuit functionality and manually developed test procedures. While functional automatic test equipment (ATE) has been reduced considerably in price, FBT test costs have not been arrested. In fact, FBT is a huge undertaking that can take several weeks or months of test engineering development, unacceptably stretching time to market. The alternative, of selling products that have not undergone comprehensive FBT is equally, if not more, intolerable....

Publisher: A.T.E. Solutions, Inc.

A.T.E. Solutions, Inc.

The leading Test, ATE and Testability consulting and educational firm, offering various test related courses. Maintains the BestTest Directory, a test community knowledge base. Publishes The BestTest eNewsletter.

Los Angeles, California, USA

Repair/Rework, Test Services, Service Provider, Training Provider

1 Liter of Gap Filler in Only 13 Seconds - New Dispensing Solution for the Thermal Management for HV Batteries

Jun 18, 2018 | Scheugenpflug

Thermal influences can significantly compromise the service life, capacity and especially the operational safety of HV batteries. In order to prevent damage due to excessive temperatures, large quantities of heat-conducting potting media are used here. Scheugenpflug has developed a new system solution for fast and reliable application of these materials....

Publisher: Scheugenpflug Inc.

Scheugenpflug Inc.

Specializes in automated metering & dispensing solutions, supplier of resin metering systems, global expert in production and process automation, vacuum dispensing production systems, and systems for dispensing of abrasive media.

Kennesaw, Georgia, USA

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Assembly

Unlocking The Mystery of Aperture Architecture for Fine Line Printing

Jun 13, 2018 | Clive Ashmore

The art of screen printing solder paste for the surface mount community has been discussed and presented for several decades. However, the impending introduction of passive Metric 0201 devices has reopened the need to re-evaluate the printing process and the influence of stencil architecture. The impact of introducing apertures with architectural dimensions’ sub 150um whilst accommodating the requirements of the standard suite of surface mount connectors, passives and integrated circuits will require a greater knowledge of the solder paste printing process.

The dilemma of including the next generation of surface mount devices into this new heterogeneous environment will create area ratio challenges that fall below todays 0.5 threshold. Within this paper the issues of printing challenging area ratio and their associated aspect ratio will be investigated. The findings will be considered against the next generation of surface mount devices....

Publisher: ASM Assembly Systems GmbH & Co. KG

ASM Assembly Systems GmbH & Co. KG

ASM Assembly Systems is the supplier of SIPLACE, a leader in surface mount technology (SMT) equipment, software, and services to the electronics assembly market.

Munich, Germany

Manufacturer of Assembly Equipment, Pick and Place, Software Manufacturer

Potting Under Vacuum or Atmosphere?

Jun 04, 2018 | Scheugenpflug

Potting under vacuum or atmospheric conditions? This question about the correct procedure concerns many users, among others i.e. electronics manufacturers, who pot more and more complex parts and components for a huge variety of products. Against the actual requirements of product and process, a decision on the procedure is often made under the assumption: „Potting under atmosphere = affordable and easy“and „Potting under vacuum = expensive and difficult“. But that’s a thing of the past. The way to the correct method, however, requires the clarification of a number of factors....

Publisher: Scheugenpflug Inc.

Scheugenpflug Inc.

Specializes in automated metering & dispensing solutions, supplier of resin metering systems, global expert in production and process automation, vacuum dispensing production systems, and systems for dispensing of abrasive media.

Kennesaw, Georgia, USA

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Assembly

Green Supply Chain Management, Economic Growth and Environment: A GMM Based Evidence

May 30, 2018 | Syed Abdul Rehman Khan, Yu Zhang, Muhammad Anees, Heris Golpîra, Arij Lahmar, Dong Qianli

The aim of this research is to examine the relationship between green logistics operations and energy demand, economic growth and environmental sustainability need to make factors for relationship clearer in a panel data of 43 different countries around the globe. The study employed panel Generalized Method of Moments (GMM) estimates for robust inferences. The results have revealed that logistics operations consume energy and fossil fuel, while the amount of fossil fuel and non-green energy sources create significant harmful effect on the environmental sustainability and also have negative effect on economic growth. In addition, poor transport-related infrastructure and logistics service are a major contributor of CO2 and total greenhouse gas emissions. However, carbon emission damages fauna and flora, and reduces economic growth. The findings suggest that renewable energy sources and green practices can mitigate harmful effect of logistics operations on environmental sustainability and spur economic activities with greatly export opportunities in a region....

Publisher: Changan University

Changan University

Changan University is one of the State 211 Project key development universities, and the advantage subject innovation platform construction university of national 985 project.

Shaanxi-Xi'an, China

School

Wettable-Flanks: Enabler for the Use of Bottom-Termination Components in Mass Production of High-Reliability Electronic Control Units

May 23, 2018 | Udo Welzel, Marco Braun, Stefan Scheller, Sven Issing, Harald Feufel

Driven by miniaturization, cost reduction and tighter requirements for electrical and thermal performance, the use of lead-frame based bottom-termination components (LF-BTC) as small-outline no-leads (SON), quad-flat no leads (QFN) packages etc., is increasing. However, a major distractor for the use of such packages in high-reliability applications has been the lack of a visible solder (toe) fillet on the edge surface of the pins: because the post-package assembly singulation process typically leaves bare copper leadframe at the singulation edge, which is not protected against oxidation and thus does not easily solder-wet, a solder fillet (toe fillet) does not generally develop....

Publisher: Robert Bosch LLC Automotive Electronics Division

Robert Bosch LLC Automotive Electronics Division

Within the Bosch-Group, the Automotive Electronics Division develops, produces, and sells microelectronic products for automotive and non-automotive applications.

Stuttgart, Germany

Other

Statistical Aspect on the Measuring of Intermetallic Compound Thickness of Lead Free Solders

May 17, 2018 | Azman Jalar, Maria Abu Bakar, Roslina Ismail, Abdul Razak Daud

Intermetallic compound (IMC) growth is being studied in earnest in this past decade because of its significant effect the solder joint reliability. It appears that from numerous investigations conducted, excessive growth of IMC could lead to solder joint failure. Leading to this, many attempts has been made to determine the actual IMC thickness. However, precise and true representation of the growth in the actual 3D phenomenon from 2D cross-section investigations has remained unclear.

This paper will focus on the measuring the IMC thickness using 3D surface profilometer (Alicona Focus G4). Lead free solder, Sn3.0Ag0.5Cu (SAC305) was soldered onto copper printed circuit board (Cu PCB). The samples were then subjected to thermal cycle (TC) storage process with temperature range from 0 °C to 100 °C for 200 cycles and up to 1000 cycles were completed....

Publisher: Universiti Kebangsaan Malaysia

Universiti Kebangsaan Malaysia

One of five research universities in Malaysia.

Selangor, Malaysia

School

Relative Humidity Dependence of Creep Corrosion on Organic-Acid Flux Soldered Printed Circuit Boards

May 09, 2018 | Haley Fu - iNEMI, Prabjit Singh - IBM Corporation, Dem Lee, Jeffrey Lee - iST-Integrated Service Technology, KarlosGuo, Julie Liu - Lenovo, Simon Lee, Geoffrey Tong - The Dow Chemical Company, Chen Xu - Nokia

Creep corrosion on printed circuit boards (PCBs) is the corrosion of copper metallization and the spreading of the copper corrosion products across the PCB surfaces to the extent that they may electrically short circuit neighboring features on the PCB. The iNEMI technical subcommittee on creep corrosion has developed a flowers-of-sulfur (FOS) based test that is sufficiently well developed for consideration as an industry standard qualification test for creep corrosion. This paper will address the important question of how relative humidity affects creep corrosion. A creep corrosion tendency that is inversely proportional to relative humidity may allow data center administrators to eliminate creep corrosion simply by controlling the relative humidity in the data center,thus, avoiding the high cost of gas-phase filtration of gaseous contamination. The creep corrosion relative humidity dependence will be studied using a modified version of the iNEMI FOS test chamber. The design modification allows the achievement of relative humidity as low as 15% in the presence of the chlorine-releasing bleach aqueous solution. The paper will report on the dependence of creep corrosion on humidity in the 15 to 80% relative humidity range by testing ENIG (gold on electroless nickel), ImAg (immersion silver) and OSP (organic surface preservative) finished PCBs, soldered with organic acid flux....

Publisher: iNEMI (International Electronics Manufacturing Initiative)

iNEMI (International Electronics Manufacturing Initiative)

iNEMI is an industry-led consortium focused on identifying and closing technology gaps, which includes the development and integration of the electronics industry supply infrastructure.

Herndon, Virginia, USA

Autonomous Maintenance (AM) increases efficiency and productivity

May 05, 2018 | Don Fitchett

With the growing demand for manufacturing facilities, authorities took many actions to escalate the efficiency of production processes. Many formal methods were implemented for a longer period of time without acquiring significant growth in the field. But with the introduction of Autonomous Maintenance (AM) to the modern manufacturing facilities they achieved an increment in efficiency and productivity in a historical brisk pace. This article is about AM Step Zero too....

Publisher: Business Industrial Network

Business Industrial Network

Offers training software and videos. Also on site training and seminars that qualify for CEUs to maintenance, engineering and management professionals.

St. Louis, Missouri, USA

Consultant, Publication or Online Resource, Service Provider, Software Manufacturer, Training Provider

Understanding the Heat Output of your BGA Rework Station

Apr 27, 2018 | Dennis O'Donnell

When performing BGA component rework, it is important to know the actual heat that is coming out of the top and bottom heaters. This will be critical in setting up accurate heat profiles. Monitoring your heat output will also keep you aware of your heaters performance so that you will know when the heaters need to be replaced....

Publisher: Precision PCB Services, Inc

Precision PCB Services, Inc

Products, Services, Training, and Consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep & Sole Agency North America for Shuttle Star BGA Rework Stations.

Oroville, California, USA

Consultant, Equipment Dealer / Broker, Manufacturer's Rep, Service Provider, Training Provider

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Software for SMT

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