• SMTnet
  • »
  • Technical Library
  • »
  • BGA Rework. A Comparative Study of Selective Solder Paste Deposition For Area Array Packages

BGA Rework. A Comparative Study of Selective Solder Paste Deposition For Area Array Packages

Published:

February 1, 2007

Author:

Ray Cirimele, Best, Inc

Abstract:

The rapid assimilation of Ball Grid Array (BGA) and other Area Array Package technology in the electronics industry is due to the fact that this package type allows for a greater I/O count in a smaller area while maintaining a pitch that allows for ease of manufacture....

  • Download BGA Rework. A Comparative Study of Selective Solder Paste Deposition For Area Array Packages article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 
Company Information:

BEST Inc.

BEST offers professional rework, repair and prototype builds of PCBs. Our expertise is on BGA rework and QFN rework. Our experienced instructors teach professional soldering classes as we are an IPC certified training center

Rolling Meadows, Illinois, USA

Repair / Rework, Service Provider, Soldering

  • Phone 847-797-9250
  • Fax 847-797-3255

BEST Inc. website

Company Postings:

(1) SMT parts, accessories & PCB supplies item

(74) products in the catalog

(20) technical library articles

(35) news releases

  • Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
  • Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
  • Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
  • Sep 02, 2021 - UV Laser PCB Depaneling Machine Improve Cutting Effect | Winsmart Electronic Co.,Ltd
  • Jun 28, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
  • Browse Technical Library »

BGA Rework. A Comparative Study of Selective Solder Paste Deposition For Area Array Packages article has been viewed 543 times

  • SMTnet
  • »
  • Technical Library
  • »
  • BGA Rework. A Comparative Study of Selective Solder Paste Deposition For Area Array Packages
IPC Certification Training Schedule

Used Equipment Auction Screen Printers, Placement Machines, Siemens Feeders, Reflow Ovens:  For Sale