New BGA Solder Mask Repair Technique Using Laser Cut Stencils

Published:

February 1, 2007

Author:

Ronald D. Schaeffer, Chief Executive Officer, Photomachining.

Abstract:

The increased replacement of high lead count SMT devices with BGAs and other high ball count area array packages has brought increased challenges to PCB rework and repair. Often solder mask areas surrounding BGA pad areas are damaged when components are removed....

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Company Information:

BEST Inc.

BEST offers professional rework, repair and prototype builds of PCBs. Our expertise is on BGA rework and QFN rework. Our experienced instructors teach professional soldering classes as we are an IPC certified training center

Rolling Meadows, Illinois, USA

Consultant / Service Provider, Manufacturer

  • Phone 847-797-9250
  • Fax 847-797-3255

BEST Inc. website

Company Postings:

(1) SMT parts, accessories & PCB supplies item

(74) products in the catalog

(20) technical library articles

(35) news releases

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