Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force

Published:

March 8, 2007

Author:

Jianbiao Pan, Brian J. Toleno, Tzu-Chien Chou, Wesley J. Dee

Abstract:

Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force....

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Company Information:

Henkel Electronic Materials

Henkel is a manufacturer of materials for PCB and component assembly. The materials include Loctite adhesives, Multicore soldering products, Hysol encaps and underfills, and Power Devices thermal phase change pads.

Irvine, California, USA

Manufacturer of Assembly Material

  • Phone 1-714-368-8000

Henkel Electronic Materials website

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