Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force
Published: |
March 8, 2007 |
Author: |
Jianbiao Pan, Brian J. Toleno, Tzu-Chien Chou, Wesley J. Dee |
Abstract: |
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force.... |
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