The Proximity of Microvias to PTHs And Its Impact On The Reliability

Published:

May 9, 2007

Author:

Anthony Primavera Manager - CSP Consortium Universal Instruments Corporation, Jaydutt Joshi, Package Development Engineer - Conexant Systems Inc.

Abstract:

High Density Interconnect (HDI) technology is fast becoming the enabling technology for the next generation of small portable electronic communication devices. These methods employ many different dielectrics and via fabrication technologies. In this research, the effect of the proximity of microvias to Plated Through Holes (PTHs) and its effect on the reliability of the microvias was extensively evaluated. The reliability of microvia interconnect structures was evaluated using Liquid-To-Liquid Thermal Shock (LLTS) testing (-55oC to +125oC). Comprehensive failure analysis was performed on microvias fabricated using different via fabrication technologies....

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Universal Instruments is a global leader in the design and manufacture of advanced automation and assembly equipment solutions for the electronics manufacturing industry.

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