Lead-free and Tin-lead Assembly and Reliability of Fine-pitch Wafer-Level CSPs

Published:

May 31, 2007

Author:

Michael Meilunas, Muffadal Mukadam, Peter Borgesen, Hari Srihari

Abstract:

This paper discusses solder paste printing and flux dipping assembly processes for 0.4 and 0.5mm pitch lead-free WLCSPs and the corresponding assembly results and thermal cyclic reliability obtained. Variables evaluated include reflow ambient, paste type, and stencil design. Reliability is also compared to results for the same components assembled under identical conditions using SnPb solder....

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Company Information:

Universal Instruments Corporation

Universal Instruments is a global leader in the design and manufacture of advanced automation and assembly equipment solutions for the electronics manufacturing industry.

Conklin, New York, USA

Manufacturer of Assembly Equipment, Pick and Place

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