Selective Solder Paste Deposition Reliability Test Results.

Published:

June 21, 2007

Author:

Bob Wettermann.

Abstract:

The rapid assimilation of Ball Grid Array (BGA) and other Area Array Package technology in the electronics industry is due to the fact that this package type allows for a greater I/O count in a smaller area while maintaining a pitch that allows for ease of manufacture (...) While there have been several studies comparing these two attachment methods, this study highlights the effect of rework technique on the electrical characteristics and reliability of reworked BGAs....

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Company Information:

BEST Inc.

BEST offers professional rework, repair and prototype builds of PCBs. Our expertise is on BGA rework and QFN rework. Our experienced instructors teach professional soldering classes as we are an IPC certified training center

Rolling Meadows, Illinois, USA

Repair / Rework, Service Provider, Soldering

  • Phone 847-797-9250
  • Fax 847-797-3255

BEST Inc. website

Company Postings:

(1) SMT parts, accessories & PCB supplies item

(74) products in the catalog

(20) technical library articles

(35) news releases

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