Achieving SMT Compatible Flip Chip Assembly With No-Flow Fluxing Underfills
Published: |
August 9, 2007 |
Author: |
Tony DeBarros and Doug Katze of Emerson and Cuming And Pericles Kondos of Universal Instruments |
Abstract: |
Recent developments in No Flow-Fluxing Underfill (NFFUF) products have demonstrated their utility to enhance the reliability of flip chip assemblies with reduced processing steps over conventional capillary flow methods. This basic work considered processing conditions such as dispensed volume and placement force, speed and dwell time. Further evaluations of these new products on a variety of flip chip assembly configurations manufactured by various processes have been undertaken to provide further evidence of their suitability and potential in high volume electronic manufacturing. This paper summarizes the recent evaluations and discusses new studies of additional assembly configurations, which include higher input/output (l/O) counts up to full arrays in excess of 1200 l/Os.... |
You must be a registered user to talk back to us. |
Company Information:
More articles from Universal Instruments Corporation »
- Oct 30, 2014 - Solder Joint Reliability Under Realistic Service Conditions
- Jan 23, 2014 - Testing Intermetallic Fragility on Enig upon Addition of Limitless Cu
- Mar 04, 2013 - Process Issues For Fine Pitch CSP Rework and Scavenging
- Nov 29, 2007 - Optimizing Flip Chip Substrate Layout for Assembly
- Sep 27, 2007 - The Pin-in-Paste (or AART) Process for Odd Form and Through Hole Printed Circuit Boards
- See all SMT / PCB technical articles from Universal Instruments Corporation »
More SMT / PCB assembly technical articles »
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 02, 2024 - Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Dec 27, 2023 - Revolutionizing Tech: SMT Auto IC Programming Machine Mastery | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
Achieving SMT Compatible Flip Chip Assembly With No-Flow Fluxing Underfills article has been viewed 871 times