The Pin-in-Paste (or AART) Process for Odd Form and Through Hole Printed Circuit Boards
Published: |
September 27, 2007 |
Author: |
Jay B. Hinerman, DEK Inc; K. Srihari, Ph.D., Department of Systems Science and Industrial Engineering State University of New York; George R. Westby, Director - SMT Laboratory, Universal Instruments Corporation. |
Abstract: |
Considerable interest exists in the process known as the pinin- paste, or the Alternative Assembly and Reflow Technology (AART) process. The AART process allows for the simultaneous reflow of both odd-form and through hole devices as well as surface mount components. This process has several advantages over the typical mixed technology process sequence that includes wave soldering and/or hand soldering, often in addition to reflow soldering.... |
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