Lead-Free Solder Wafer Bumping
Published: |
December 6, 2007 |
Author: |
Fred Dimock, Kristen Mattson. |
Abstract: |
Over the past 30 years we have learned that lead has negative affects on the health of humans and seen strong legislation remove it from gasoline and paints. More recently, governments in Europe and Asia have set deadlines to remove lead from consumer electronic devices that use printed circuit boards. Currently, the ban is not being applied to high reliability applications such as military or medical devices, but we all know that will come someday soon. Likewise many believe that lead free solder is coming to wafer bump reflow and are beginning to make the transition.... |
You must be a registered user to talk back to us. |
Company Information:
More articles from BTU International »
- Apr 21, 2021 - Operation of a Vacuum Reflow Oven with Void Reduction Data
- Oct 24, 2019 - Thermal Profiles - Why Getting Them Right is Important
- Nov 08, 2007 - Making A Case for Continuous Furnaces
- Oct 10, 2007 - Maximizing Process Control with Controlled Convection Rates
- See all SMT / PCB technical articles from BTU International »
More SMT / PCB assembly technical articles »
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 02, 2024 - Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Dec 27, 2023 - Revolutionizing Tech: SMT Auto IC Programming Machine Mastery | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
Lead-Free Solder Wafer Bumping article has been viewed 939 times