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A New Stencil Rulebook for Wafer Level Solder Ball Placement using High Accuracy Screen Printing

Published:

December 13, 2007

Author:

Steve Watkin, Semicon Packaging Technologies Division, and Tom Falcon, Future Technologies Group, DEK

Abstract:

Printer-hosted processes for solder ball placement are now widely used for package technologies ranging from BGAs using ball diameters above 750μm to the latest WL-CSPs demanding 250μm diameter. This broadening spectrum of applications brings more choices in terms of stencil design rules and production methodologies....

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Company Information:

ASM Assembly Systems (DEK)

The ASM SMT Solutions segment is made up of SMT Printing Solutions (DEK) and SMT Placement Solutions (SIPLACE). Under the DEK brand, it sells best-in-class printing solutions for the electronics and solar industries.

Suwanee, Georgia, USA

Screen Printing

  • Phone +1 770 797-3000

ASM Assembly Systems (DEK) website

Company Postings:

(10) products in the catalog

(4) technical library articles

(145) news releases

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