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Process Development And Characterization Of The Stencil Printing Process For Small Apertures

Published:

January 16, 2008

Author:

Dr. Daryl Santos, SUNY Binghamton; Dr. Rita Mohanty, Speedline Technologies

Abstract:

The consumer's interest for smaller, lighter and higher performance electronics products has increased the use of ultra fine pitch packages, such as Flip Chips and Chip Scale Packages, in printed circuit board (PCB) assembly. The assembly processes for these ultra fine pitch packages are extremely complex and each step in the assembly process influences the assembly yield and reliability....

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Company Information:

Speedline Technologies, Inc.

Speedline Technologies serves the electronics assembly and semiconductor packaging industries with class-leading equipment, responsive support and unparalleled process knowledge.

Franklin, Massachusetts, USA

Adhesives / Dispensing, Cleaning, Manufacturer of Assembly Equipment, Screen Printing, Soldering

  • Phone 5085414749
  • Fax 5085202288

Speedline Technologies, Inc. website

Company Postings:

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