SnAgCuBi and SnAgCuBiSb Solder Joint Properties Investigations

Published:

February 5, 2008

Author:

Kisiel R., Institute of Microelectronics and Optoelectronics; Bukat K. and Sitek J., Tele and Radio Research Institute; Gasior W., Moser Z. and Pstru_ J., Polish Academy of Sciences

Abstract:

This study investigates the technological properties of quaternary or quinary alloys made by addition Bi or Bi and Sb elements to the SnAgCu solders. The influence of added elements on the electrical and mechanical properties of solder joints created by these solders between PCB and electronic components were evaluated....

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Company Information:

Unipress - Institute of High Pressure Physics of the Polish Academy of Sciences

The mission of Unipress is to use high pressure methods for advanced fundamental research and technology development. The main fields: Solid state physics, Optoelectronics, Sintering of nanocrystalline materials...

Warsaw, Poland

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Unipress - Institute of High Pressure Physics  of the Polish Academy of Sciences website

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