Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures
Published: |
February 26, 2008 |
Author: |
Michael J. Rowlands, Rabindra N. Das |
Abstract: |
More and more chip packages need multi-GHz RF structures to meet their performance targets. The ideal chip package needs to combine RF features with Digital features for these applications. They drive low-loss, controlled impedance transmission lines, flexibility in assigned signal and power layers, and clearances of various shapes in power layers. Building these features in a chip package is difficult without making the stack-up very thick or compromising the reliability of the product. In the present paper, we have designed and built a flip-chip package test vehicle (TV) to make new RF structures, using Z-axis interconnection (Zinterconnect) building blocks.... |
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