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Pushing the barriers of wafer level device integration: High-speed assembly, the case for MicroTape.

Published:

January 21, 2009

Author:

Gordon Christison

Abstract:

Over the last 10 years, the adoption of wafer-level packaging (WLP) has expanded to a wide range of semiconductor devices applied in a crosssection of industries from Automotive to Mobile Phone, Sensors to Medical Technology....

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Company Information:

Siemens industrial manufacturing software, process automation, and automation and drives technology increases flexibility, cuts market launch lead time, and significantly reduces energy for manufacturing companies.

Alpharetta, Georgia, USA

Consultant / Service Provider, Manufacturer, Training Provider

  • Phone +1 (770) 740-3000
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