Reliability and Failure Mechanisms of Laminate Substrates in a Pb-free World

Published:

April 30, 2009

Author:

Kevin Knadle.

Abstract:

This presentation surveys the most significant via and via-related laminate failure mechanisms from past to present using data from current induced thermal cycling (CITC) testing, failure analysis, and other sources. The relative life and failure modes of thru vias, buried vias, and microvias (stacked vs. non-stacked) are compared, along with the affect of structure, materials, and peak temperatures on the above. The origin of via-induced laminate failures such as "eyebrow cracks" and Pb free related internal delamination is also explored....

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Company Information:

A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.

Endicott, New York, USA

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  • Phone 866 820-4820
  • Fax 607 755-7000

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