Solder Phase Coarsening, Fundamentals, Preparation, Measurement and Prediction

Published:

May 7, 2009

Author:

Crina Rauta, Dr. Abhijit Dasgupta and Dr. Craig Hillman, DfR Solutions.

Abstract:

Thermal fatigue has been one of the most serious problems for solder joint reliability. Thermo-mechanical fatigue failure is considered to be closely related to micro-structural coarsening (grain/phase growth). Factors that influence the phase growth are studied and measurement methods are discussed, including the preparation of the eutectic solder sample for phase size measurement. Three categories of models used to predict grain growth in polycrystalline materials are presented. Finally, phase growth in solder during high temperature aging and temperature cycling and its use as a damage correlation factor are discussed....

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Company Information:

DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry.

College Park, Maryland, USA

Consultant / Service Provider

  • Phone 301 474-0607
  • Fax 240 757-0083

See Company Website »

Company Postings:

(1) product in the catalog

(27) technical library articles

(1) news release

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