Drop Shock Reliability of Lead-Free Alloys - Effect of Micro-Additives

Published:

June 11, 2009

Author:

Ranjit S Pandher, Brian G Lewis, Raghasudha Vangaveti, Bawa Singh

Abstract:

The shock reliability of solder joints has become a major issue for the electronic industry partly because of the ever increasing popularity of portable electronics and partly due the transition to lead free solders....

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Leading materials science company that provides high performance materials, chemistry and technology solutions to the electronics and surface finishing industries worldwide.

Lakeville, Minnesota, USA

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  • Phone 508-520-0083

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