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Resin Coated Copper Capacitive (RC3) Nanocomposites for System in a Package (SiP): Development of 3-8-3 structure

Published:

October 8, 2009

Author:

Rabindra N. Das, Konstantinos I. Papathomas, Steven G. Rosser, Tim Antesberger, John M. Lauffer, Mark D. Poliks and Voya R. Markovich.

Abstract:

In the present study, we report novel ferroelectric-epoxy based polymer nanocomposites that have the potential to surpass conventional composites to produce thin film capacitors over large surface areas, having high capacitance density and low loss. Specifically, novel crack resistant and easy to handle Resin Coated Copper Capacitive (RC3) nanocomposites capable of providing bulk decoupling capacitance for a conventional power-power core, or for a three layer Voltage-Ground-Voltage type power core, is described....

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Company Information:

i3 Electronics

A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.

Endicott, New York, USA

Assembly, Component Packaging, Contract Manufacturer, Manufacturer of Assembled PCBs, Manufacturer of Bare PCBs

  • Phone 866 820-4820
  • Fax 607 755-7000

i3 Electronics website

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