Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages
Published: |
March 30, 2010 |
Author: |
Andrew Farris, Jianbiao Pan, Albert Liddicoat, Michael Krist, Nicholas Vickers, Brian J.Toleno, Dan Maslyk, Dongkai Shangguan, Jasbir Bath, Dennis Willie, David A. Geiger. |
Abstract: |
This paper presents the drop test reliability results for edge-bonded 0.5mm pitch lead-free chip scale packages (CSPs) on a standard JEDEC drop reliability test board.... |
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