Leaded and Lead-Free Solder Paste Evaluation Screening Procedure

Published:

May 12, 2010

Author:

Ronald C. Lasky, Ph.D., PE; Indium Corporation of America Daryl Santos, Ph.D., Aniket A. Bhave; Binghamton University

Abstract:

Numerous studies have shown that greater than 60% of end of line defects in SMT assembly can be traced to solder paste and the printing process. Reflowing adds another 15% or so. In light of this fact, it is surprising that no simplified procedure for solder paste evaluation has been documented. This paper is about such a procedure....

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Company Information:

Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Utica, New York, USA

Manufacturer of Assembly Material, Soldering

  • Phone 315-853-4900
  • Fax 315-853-1000

Indium Corporation website

Company Postings:

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