3D IC Development Needs Innovative Socket Solution
Published: |
October 7, 2010 |
Author: |
Ila Pal |
Abstract: |
Evolution from cell phones with only a base-band processor and limited memory to today's high-end phones with an additional applications processor and memory has driven the industry to 3-D packaging solutions. 3-D packaging can be achieved via die stackin... |
|
|
|
|
|
|
You must be a Company Information:
More articles from Ironwood Electronics »
- May 26, 2011 - Package Converter Compliments Chip Obsolescence
- See all SMT / PCB technical articles from Ironwood Electronics »
More SMT / PCB assembly technical articles »
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 02, 2024 - Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Dec 27, 2023 - Revolutionizing Tech: SMT Auto IC Programming Machine Mastery | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
3D IC Development Needs Innovative Socket Solution article has been viewed 700 times
