Manufacturing Substrates with Embedded Passives

Published:

May 5, 2011

Author:

R. N. Das, K. I. Papathomas J. M. Lauffer, S. Rosser, M. D. Poliks, V. R. Markovich

Abstract:

Passives account for a very large part of today’s electronic assemblies. This is particularly true for digital products such as cellular phones, camcorders, and computers. Market pressures for new products with more features, smaller size and lower cost v...

  • Download Manufacturing Substrates with Embedded Passives article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 
Company Information:

i3 Electronics

A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.

Endicott, New York, USA

Assembly, Component Packaging, Contract Manufacturer, Manufacturer of Assembled PCBs, Manufacturer of Bare PCBs

  • Phone 866 820-4820
  • Fax 607 755-7000

i3 Electronics website

Company Postings:

(3) products in the catalog

(20) technical library articles

(26) news releases

  • Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
  • Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
  • Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
  • Sep 02, 2021 - UV Laser PCB Depaneling Machine Improve Cutting Effect | Winsmart Electronic Co.,Ltd
  • Jun 28, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
  • Browse Technical Library »

Manufacturing Substrates with Embedded Passives article has been viewed 603 times

Industry 4.0 Reflow Oven

Reflow Oven