Quantitative Evaluation of New SMT Stencil Materials

Published:

June 29, 2011

Author:

Chrys Shea, Quyen Chu, Sundar Sethuraman, Rajoo Venkat ,Jeff Ando, Paul Hashimoto

Abstract:

High yields in the stencil printing process are essential to a profitable SMT assembly operation. But as circuit complexity continues to increase, so do the challenges of maintaining a successful solder paste deposition process. To help assemblers address...

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