Are Separate Solder Flip-Chip Bonders Still Required?
Published: |
October 13, 2011 |
Author: |
Eric Klaver, Senior Product Manager, Assembléon. Patrick Huberts, Product Manager Semicon Market. |
Abstract: |
Increasing miniaturization is now encouraging manufacturers of handheld devices to stack bare dies or packages. As the process of manufacturing modules requires placing both passives and (stacked) bare dies, these two types of placement are merging very quickly into a single platform. That raises the question of whether SMT equipment will take over from traditional die bonders.... |
|
|
|
|
|
|
You must be a Company Information:
More articles from Assembléon »
- Mar 01, 2012 - Why Sacrifice Throughput For Change-Over Time?
- Jul 21, 2011 - Production Line Dynamics: What Count Is What Actually Comes Out Of Your Line
- May 19, 2011 - Improve Margins By Reducing Rework - A Benchmark Comparison
- Nov 12, 2010 - Assembling the Next Electronic Equipment Generations.
- Jul 29, 2010 - 01005 Production Goes Industry Wide
- See all SMT / PCB technical articles from Assembléon »
More SMT / PCB assembly technical articles »
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 02, 2024 - Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Dec 27, 2023 - Revolutionizing Tech: SMT Auto IC Programming Machine Mastery | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
Are Separate Solder Flip-Chip Bonders Still Required? article has been viewed 687 times
