Three-Dimensional MMIC and Its Evolution to WLCSP Technology

Published:

January 19, 2012

Author:

Tsuneo TOKUMITSU

Abstract:

The history of multilayered, three-dimensional monolithic microwave integrated circuit (3-D MMIC) technology is described here. Although significant researches were carried out in the second half of 1990’s, still there were many twists and turns before an...

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Company Information:

Manufacturer of cable, materials & equipment for the semiconductor and opto-electronic industries; supplying telecommunications, power transmission, information technology and automotive cable markets

Osaka, Japan

Manufacturer

  • Phone +81 6 6220 4141
  • Fax +81 6 6222 3380

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Company Postings:

(1) technical library article

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