Assembly and Rework of Lead Free Package on Package Technology

Published:

March 22, 2012

Author:

Raymond G. Clark, Joseph D. Poole, TT Electronics - IMS

Abstract:

Miniaturization continues to be a driving force in both integrated circuit packaging and printed circuit board laminate technology. In addition to decreasing component pitch (lead to lead spacing), utilization of the vertical space by stacking packages ha...

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Electronics

Electronics

Perry , Ohio, USA

  • Phone 440-352-8961
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